Sensor Module Protruding PCB for Air Quality

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Solution Overview

Problem

Conventional sensor modules for air quality measurement are often large, sensitive to mechanical damage, difficult to install, require multiple chambers, and can provide inaccurate or sluggish measurements due to outgassing.

Innovation Solution

A compact sensor module with a printed circuit board and housing, where the circuit board protrudes from the housing with sensors directly exposed to the environment, encapsulated with a filling compound to enhance robustness and eliminate the need for measuring chambers, featuring a robust plastic housing and integrated sensors for temperature, humidity, and gas measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional sensor arrangements use multiple chambers for measuring various air parameters, then measurement capability is improved, but device complexity and size increase

Engineering Contradiction:
Improvemeasurement capabilityVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple sensors (temperature sensor, humidity sensor, gas sensor) onto a single printed circuit board, eliminating the need for multiple separate chambers. This integration maintains comprehensive measurement capability while significantly reducing device complexity and size.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The printed circuit board serves as a universal platform that hosts multiple different types of sensors, allowing the device to measure various air parameters (temperature, humidity, gas concentration) in a single integrated structure rather than requiring separate specialized chambers for each measurement type.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Strength

If conventional sensor modules are enclosed in chambers, then protection from mechanical damage is improved, but measurement accuracy deteriorates due to outgassing

Engineering Contradiction:
Improveprotection from mechanical damageVSAvoidmeasurement accuracy
Core Design Contradiction:
StrengthVSMeasurement precision

Solution Approach 1:

The patent extracts the sensors from enclosed chambers and places them directly on the printed circuit board that protrudes from the housing. This eliminates the chamber structure that causes outgassing, thereby improving measurement accuracy while the housing still provides external mechanical protection.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The housing provides mechanical protection for the electronic components and circuit board, while the sensor area remains exposed for accurate measurement. This local differentiation allows the device to have both protection where needed and exposure where measurement accuracy is critical.

Inventive Principle:
Principle #3Local quality

3Strength

If sensors are placed in enclosed chambers, then protection from mechanical damage is improved, but measurement speed deteriorates due to sluggish response

Engineering Contradiction:
Improveprotection from mechanical damageVSAvoidmeasurement speed
Core Design Contradiction:
StrengthVSSpeed

Solution Approach 1:

The sensors are extracted from enclosed chambers and positioned directly on the printed circuit board for immediate exposure to the measured environment. This eliminates the diffusion path through chamber walls, enabling fast response times while the housing protects the overall device structure.

Inventive Principle:
Principle #2Taking out (Extraction)

4Adaptability or versatility

If multiple individual sensors are used, then measurement capability is improved, but ease of installation deteriorates

Engineering Contradiction:
Improvemeasurement capabilityVSAvoidease of installation
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

Multiple individual sensors are merged onto a single printed circuit board assembly, which is then installed as one integrated unit. This maintains the capability to measure multiple air parameters (temperature, humidity, gas concentration) while dramatically simplifying installation compared to installing separate sensors and chambers individually.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11879752B2Sensor module for air quality measurement
Publication Date: 2024.01.23 SENSIRION AG
  • US11879752B2 patent drawing
  • US11879752B2 patent drawing
  • US11879752B2 patent drawing

AI summary

A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (10), wherein the at least one sensor (21, 22) is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.