Shielded Sensor Module Solder Joint Layout for Stable Grounding
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Solution Overview
Problem
Existing sensor modules face challenges in stabilizing the connection between the shield case and the ground line due to heat escape when soldering, affecting operational reliability.
Innovation Solution
The sensor module incorporates a thermal storage region around the third hole of the shield case, covered with solder material, to facilitate soldering and enhance connection reliability between the shield case and the external connector.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the shield case is joined to the ground line using soldering, then the connection between the shield case and ground line is established, but heat escapes to the shield case making the soldering operation difficult and reducing connection reliability
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the shield case and the ground line. This resin layer has thermal insulation properties that prevent heat from escaping to the shield case during soldering, while still allowing electrical connection through the ground line to the shield case. The resin thus mediates between the conflicting requirements of heat isolation and electrical connection.
Solution Approach 2:
The thermal conductivity parameter of the interface between the shield case and ground line is changed by coating the ground line with resin. This reduces the thermal conductivity at this interface, preventing heat transfer to the shield case during soldering, while maintaining the electrical conductivity needed for ground connection.
2Object-affected harmful factors
If the shield case is made of metallic material for EMC measures, then electromagnetic compatibility is improved, but heat escapes to the shield case during soldering
Solution Approach 1:
The resin coating is applied locally at specific positions on the ground line where it contacts the shield case, rather than coating the entire shield case or ground line. This localized application provides thermal insulation exactly where heat escape occurs during soldering, while preserving the metallic properties of the shield case for EMC protection and allowing electrical connection where needed.
Solution Approach 2:
The resin acts as a thermal intermediary layer between the metallic shield case and the soldering heat source (ground line connection point). It mediates the thermal interaction by blocking heat transfer to the shield case while allowing the electrical connection to function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for easier and more reliable soldering operations, ensuring stable connections and improved electromagnetic compatibility (EMC) measures.
Implementation Method 1
the bottom portion includes a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion
Data Source
AI summary
A sensor module according to an embodiment of the present technology includes a housing, a sensor board, an external connector, a flexible printed circuit, and a metallic shield case. The flexible printed circuit electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line. The shield case includes a bottom portion that is arranged between the flexible printed circuit and the external connector. The external connector includes a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case. The bottom portion includes a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.