Sensor Module Substrate Segmentation for Wire Bonding

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Solution Overview

Problem

Existing force sensor devices face challenges in mass production due to interference from semiconductor mounting devices during the wire bonding process, primarily because the sensor is directly mounted on a large housing, leading to increased distance and compatibility issues.

Innovation Solution

A sensor module is designed with a substrate, a sensor chip mounted on one surface to detect axial displacement, bonding wires for electrical coupling, and a protective frame around the substrate, ensuring the bonding wires are separated from the protective frame to prevent interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the sensor is directly mounted on the housing, then the force characteristics are maintained, but the wire bonding process becomes difficult due to increased distance and interference from semiconductor mounting devices

Engineering Contradiction:

Improveforce characteristicsVSAvoidwire bonding process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent divides the mounting structure into two separate components: a substrate that directly supports the sensor chip (maintaining force characteristics) and a housing that provides structural support. This segmentation allows the sensor to be mounted on the substrate rather than directly on the large housing, reducing the wire bonding distance and eliminating interference from semiconductor mounting devices while preserving the force transmission path.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate acts as an intermediary component between the sensor chip and the housing. It provides a suitable mounting surface for the sensor while being coupled to the housing, thereby mediating the connection and enabling standard semiconductor mounting processes without compromising force characteristics.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If the sensor is mounted on a large housing, then structural support is provided, but standard semiconductor mounting devices cannot be used due to increased distance in wire bonding

Engineering Contradiction:

Improvestructural supportVSAvoidcompatibility with semiconductor mounting devices

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent segments the support function from the mounting function. The housing provides structural support, while the substrate provides the mounting surface for the sensor. This allows standard semiconductor mounting devices to be used on the substrate without requiring direct mounting on the large housing, thereby maintaining compatibility with existing manufacturing equipment.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate serves multiple functions: it acts as the mounting surface for the sensor chip, provides electrical connections through bonding wires, and couples to the housing for structural support. This multi-functionality enables the use of standard semiconductor mounting devices while maintaining structural integrity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Device complexity

If the bonding wire is close to the protective frame, then space is saved, but interference occurs during the wire bonding process

Engineering Contradiction:

Improvespace utilizationVSAvoidwire bonding process

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The patent extracts the bonding wire path from the region near the protective frame by utilizing the substrate's mounting surface. The bonding wires are routed through openings in the substrate to connect the sensor chip electrodes to the substrate's bonding pads, separating the wire bonding process from the protective frame area and eliminating interference.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent utilizes the third dimension (depth/thickness) by routing bonding wires through openings in the substrate rather than routing them on the surface near the protective frame. This vertical routing path eliminates interference with the protective frame while maintaining compact space utilization.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sensor module improves mass production of force sensor devices by allowing the use of standard semiconductor mounting devices, reducing wire bonding difficulties, and maintaining the same force characteristics as direct attachment, while enhancing production efficiency.

Implementation Method 1

a sensor chip (100) mounted on one surface of the substrate (310) and configured to detect a predetermined axial displacement

Methodology Applied

Scientific EffectPiezoresistive effect: Piezoresistive Effect

Implementation Method 2

a bonding wire (90) that electrically couples a first electrode (313) formed on the one surface of the substrate (310) to a second electrode (110) of the sensor chip (100)

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250164325A1Sensor module and force sensor device

Publication Date: 2025.05.22 MINEBEAMITSUMI INC

AI summary

A sensor module includes a substrate, a sensor chip mounted on one surface of the substrate to detect a predetermined axial displacement, a bonding wire that electrically couples a first electrode formed on the one surface of the substrate to a second electrode of the sensor chip, and a protective frame provided on the periphery of the one surface of the substrate. The protective frame is apart from the bonding wire.