Sensor Module Top Plate Segmentation for Mounting Stability
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Solution Overview
Problem
Sensor modules, including gas sensors, experience unstable posture during surface-mounting on circuit boards due to eccentric planar portions on protective caps, leading to potential instability and inadequate air circulation.
Innovation Solution
A sensor module design featuring a top plate with a center area devoid of through holes, allowing stable suction by chip mounter nozzles, and a through hole formation area surrounding the center, ensuring stable posture and sufficient air circulation, along with an optional filter to prevent foreign matter entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If through holes are distributed across the entire top plate part, then air circulation is improved, but the posture stability during chip mounting deteriorates
Solution Approach 1:
The top plate part is segmented into three distinct zones: a center area with no through holes for stable mounting, a through hole formation area surrounding the center for air circulation, and an outside area for additional structural support. This spatial segmentation allows each zone to fulfill its specific function without interfering with others.
Solution Approach 2:
Different regions of the top plate part are assigned different properties: the center area has a planar structure for suction stability, the through hole formation area has through holes for gas permeation, and the outside area provides additional mounting stability. Each local region is optimized for its specific function.
2Ease of operation
If a planar portion is formed on the protective cap for chip mounting, then ease of operation is improved, but posture stability deteriorates due to eccentric positioning
Solution Approach 1:
The top plate part features an asymmetric configuration where the center area (for mounting) and through hole formation area are positioned eccentrically relative to each other. The center area is offset from the geometric center of the top plate, allowing the sensor element to be positioned optimally while maintaining a stable mounting surface.
3Ease of operation
If the center area of the top plate part is positioned eccentrically, then ease of operation is improved, but manufacturing precision deteriorates
Solution Approach 1:
The center area and through hole formation area are pre-positioned in specific eccentric locations during the design and manufacturing phase. This preliminary positioning ensures that the sensor element is correctly located relative to the mounting surface and through holes, eliminating the need for post-assembly adjustments and ensuring high positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design stabilizes the sensor module during mounting and maintains air circulation, preventing foreign matter ingress while allowing for efficient inspection and attachment processes.
Implementation Method 1
when it is sucked by the chip mounter suction nozzle
Data Source
Figure 1~2
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Figure 5~6
AI summary
Disclosed herein is a sensor module that includes a substrate having a top surface and a back surface, a sensor element mounted on the top surface of the substrate, an external terminal formed on the back surface of the substrate, and a case fixed to the substrate so as to cover the sensor element. The case has a top plate part having a plurality of through holes. The top plate part has a center area having no through holes and a through hole formation area having the plurality of through holes, the through hole formation area being positioned so as to surround the center area.