Semiconductor Sensor Mold Projections for Resin Flow Control
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Solution Overview
Problem
In the manufacturing of semiconductor sensors, the existing methods require the film to be attached to the entire surface of the upper mold to prevent resin material from entering spaces between the film and the mold, leading to film waste and inefficiency.
Innovation Solution
A method where a metallic island portion with a plate shape is used, with the semiconductor chip mounted such that its back surface is on the island portion, and a mold with projections is employed to fill the resin material into the first cavity before the second cavity, reducing the need for the film to cover the entire mold surface and minimizing waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the film is attached to the entire surface of the upper mold to prevent resin material from entering spaces, then the reliability of preventing resin entry is improved, but the loss of substance (film waste) increases
Solution Approach 1:
The film is selectively attached only to specific portions of the upper mold surface that correspond to the first cavity, rather than the entire surface. This localized attachment strategy prevents resin entry where needed while reducing film consumption on areas where resin will not penetrate, thereby resolving the contradiction between reliability and substance loss.
Solution Approach 2:
The mold cavity is divided into a first cavity and a second cavity, with the film applied only to the first cavity region. This segmentation allows differential film application, concentrating protective coverage where resin flow and potential entry risks exist while leaving other areas uncovered, thus reducing overall film usage without compromising prevention effectiveness.
2Reliability
If the film covers the entire mold surface, then the protection against resin entry is improved, but the productivity of the manufacturing process deteriorates due to increased material handling and waste
Solution Approach 1:
By applying the film only to the first cavity portion where resin entry risks exist, rather than covering the entire mold surface, the process reduces material handling time and waste removal operations. This localized approach maintains necessary protection while improving manufacturing efficiency and productivity.
3Loss of time
If the resin material is filled into both cavities simultaneously, then the manufacturing time is reduced, but the control over resin distribution and film protection deteriorates
Solution Approach 1:
The film is pre-applied to the first cavity before resin injection begins. This preliminary protective measure ensures that when resin is injected into both cavities, the first cavity is already protected, allowing simultaneous filling without compromising control over resin distribution or film integrity, thus resolving the time-precision contradiction.
Data Source
AI summary
In a method for manufacturing a semiconductor sensor, an upper mold has a pair of projections on a wall surface opposing to side surfaces of a semiconductor chip in a first cavity and at positions closest to a second cavity. The projections project so as to reduce the space between the side surfaces of the semiconductor chip and the upper mold, so that a flow of a resin material from a first cavity to a second cavity is delayed. The resin material is filled in the first cavity prior to the second cavity. After a portion of a film corresponding to the first cavity is entirely brought into close contact with the upper mold, the resin material is filled in the second cavity.