Interlocking Sensor Mount for Cryogenic Thermal Isolation

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Solution Overview

Problem

Sensors in extreme temperature environments, such as cryogenic fuel tanks, often malfunction due to ice buildup when not properly thermally isolated, leading to malfunctions in automotive, aviation, and aerospace applications.

Innovation Solution

A thermally-isolated sensor mount with interlocking segments providing high thermal resistance, utilizing natural gaps between microscopic surface waviness and asperities, and adjustable surface roughness and emissivity coatings to maintain sensor operation in extreme temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a sensor is mounted directly on a cryogenic fuel tank substrate, then the sensor can be easily installed and structurally simple, but the sensor will be exposed to extreme cold temperatures causing ice buildup and malfunction

Engineering Contradiction:
Improvesensor operation reliabilityVSAvoidmount structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sensor mount is divided into multiple discrete segments (first segment, second segment, third segment) that can be assembled together. Each segment serves a specific thermal isolation function, allowing the complex thermal protection to be broken down into manageable components that are easier to manufacture and install.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mount structure uses nested segments where the second segment is positioned within the first segment, and the third segment is positioned within the second segment. This nested configuration creates multiple thermal barriers in series, significantly increasing thermal resistance while maintaining a compact overall structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Temperature

If multiple interlocking segments are used to increase thermal isolation, then thermal resistance increases and sensor protection improves, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvethermal resistanceVSAvoidmanufacturing ease
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

Different segments of the mount are designed with different local properties optimized for their specific functions. For example, external surfaces have specific emissivity characteristics for thermal radiation control, while internal surfaces have specific roughness characteristics for gap thermal resistance. This localized optimization allows each segment to be manufactured independently with focused quality control.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The interlocking segments are designed with adjustable fit tolerances (ANSI fit classes RC1-9) that allow the assembly to be tuned for optimal thermal performance. The gaps between segments can be controlled during assembly to achieve desired thermal resistance levels, providing flexibility in manufacturing and field installation.

Inventive Principle:
Principle #15Dynamics

3Strength

If the sensor mount is made compact and rugged, then the device size is reduced and structural strength is improved, but the thermal isolation capability may be compromised

Engineering Contradiction:
Improvestructural strengthVSAvoidthermal isolation
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The sensor mount segments are made from materials with low thermal conductivity (such as polymers or composite materials) that provide both structural strength and thermal isolation properties. This allows the mount to maintain mechanical integrity while effectively blocking heat transfer from the cryogenic substrate to the sensor.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures proper sensor operation in extreme temperatures by preventing ice buildup and maintaining thermal isolation, applicable to various applications including spacecraft, aircraft, and industrial settings.

Implementation Method 1

Natural gaps between the interlocking layers due to microscopic surface waviness and asperities increase the thermal resistance between adjoining surfaces. This is known as 'gap thermal resistance.'

Methodology Applied
Scientific EffectGap thermal resistance: Thermal Insulation

Implementation Method 2

Various combinations of surface roughness and tightness of fit or pressure (such as ANSI fit class RC1-9) and external surface emissivity coatings can be determined by analysis and testing

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP4484900A1Thermally isolated sensor mount for cryogenic or high temperature applications
Publication Date: 2025.01.01 THE BOEING CO
  • EP4484900A1 patent drawingFigure 1
  • EP4484900A1 patent drawingFigure 2
  • EP4484900A1 patent drawingFigure 3

AI summary

A thermally-isolated sensor mounting structure, including at least two, nested, interlocking segments, including a lower segment and an upper segment attached to the lower segment, with one or more gaps between the upper and lower segments. The upper segment comprises a passageway for holding a sensor probe. The sensor mount can be a prismatic assembly that uses dovetail joints, or a threaded cylindrical assembly that is screwed together. The sensor mount can be attached to a substrate that is extremely cold or hot. Gap thermal resistance between the upper and lower segments plus optional optical coatings isolates the sensor probe from extreme temperatures. Mating surfaces can be artificially roughened or polished to increase the gap thermal resistance. The sensor probe can be screwed into the sensor mount. A total of four (or more) interlocking segments provides sufficient thermal isolation from a cryogenic substrate to prevent ice buildup on the sensor.