Sensor Mounting Bracket Thermal Isolation

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Solution Overview

Problem

The high temperature environment in exhaust aftertreatment systems, particularly in stationary applications with insufficient airflow, poses challenges for locating sensors and electronics required for emissions compliance, as they are prone to overheating and premature failure.

Innovation Solution

The arrangement includes standoff members and enclosures to thermally isolate electrical components within the aftertreatment module, using thermally insulating materials and reflective enclosures to reduce heat conduction and radiation, while maintaining positional rigidity and creating air gaps for heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If electrical components are mounted directly to the aftertreatment module, then device complexity is reduced, but temperature increases causing premature failure

Engineering Contradiction:
Improvemounting arrangement complexityVSAvoidelectrical component temperature
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent introduces a mounting bracket as an intermediary component between the aftertreatment module and electrical components. This bracket is thermally isolated from the module using heat sink material, creating a thermal buffer that protects sensors and electronics from high temperatures while maintaining mechanical mounting functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent extracts electrical components from direct thermal contact with the aftertreatment module by mounting them on a separate bracket structure. This separation removes the harmful thermal influence from the components while preserving the necessary mounting and positioning functions.

Inventive Principle:
Principle #2Taking out (Extraction)

2Temperature

If airflow is increased to cool the system, then temperature is reduced, but in stationary applications airflow is insufficient

Engineering Contradiction:
Improvesystem temperatureVSAvoidairflow availability
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent converts the harmful direct thermal radiation from the aftertreatment module into a beneficial cooling mechanism by using heat sink material on the mounting bracket. This material absorbs and dissipates heat, transforming the thermal challenge into a controlled heat management solution that works passively without requiring additional airflow.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Volume of moving object

If sensors are located close to the aftertreatment module, then space is saved, but reliability decreases due to overheating

Engineering Contradiction:
Improvepackaging spaceVSAvoidsensor reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The mounting bracket serves as a thermal intermediary that allows sensors to be positioned close to the aftertreatment module for space efficiency while simultaneously protecting them from harmful temperatures. The heat sink material on the bracket creates a thermal barrier that maintains sensor reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively maintains sensor component temperatures below failure thresholds, preventing premature failure and ensuring reliable emissions monitoring and control in high-temperature environments.

Implementation Method 1

a mounting bracket thermally isolated from the aftertreatment module by heat sink material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an air gap between the bracket and the aftertreatment module

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

The enclosure may be reflective to reduce the amount of thermal energy absorbed by the sensor or associated electronics

Methodology Applied
Scientific EffectThermal radiation reflection: Reflection

Data Source

PatentUS9217355B2Sensor mounting arrangement
Publication Date: 2015.12.22 CATERPILLAR INC
  • US9217355B2 patent drawing
  • US9217355B2 patent drawing
  • US9217355B2 patent drawing

AI summary

An arrangement for mounting at least one electrical component to a portion of an aftertreatment module, the arrangement including; at least one standoff member coupled between the electrical component and the portion of the aftertreatment module, and an enclosure substantially surrounding at least three sides of the electrical component.