Semiconductor Sensor Flat Mounting Plate Gel Containment

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Solution Overview

Problem

The high flowability of gel used to cover and protect bare chips in semiconductor sensors causes it to flow out and deteriorate the connecting strength between components, leading to increased manufacturing costs due to the need for larger sensor sizes with surrounding banks to prevent this issue.

Innovation Solution

Forming banks only at the sides of the flat mounting surface with curved concave surfaces and depressed portions on the inner wall to prevent gel flow, trapping it and reducing capillary action, without fully surrounding the mounting surface, thus maintaining a compact sensor size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If banks are formed to entirely surround the mounting surface to prevent gel flow, then gel containment is improved, but sensor size increases

Engineering Contradiction:
Improvegel containmentVSAvoidsensor size
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The bank structure is segmented into two distinct portions: a first portion with a first height and a second portion with a second height greater than the first height. This segmentation allows the gel to be contained effectively at critical areas while minimizing the overall footprint of the bank structure, thereby preventing gel flow without unnecessarily increasing sensor size.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bank structure exhibits local quality variation through its two-height design, where the taller second portion is strategically positioned to provide enhanced containment at specific locations where gel flow is most problematic, while the shorter first portion suffices for areas with lower containment requirements. This localized differentiation optimizes gel containment effectiveness while minimizing overall sensor size.

Inventive Principle:
Principle #3Local quality

2Reliability

If high flowability gel is used to cover bare chips, then protection effectiveness is improved, but gel flow out increases

Engineering Contradiction:
Improvechip protectionVSAvoidgel flow out
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The bank structure serves as an intermediary element between the high flowability gel and the mounting surface. By introducing this physical barrier with varying heights, the gel's protective function is maintained while its harmful flow-out behavior is prevented. The bank acts as a mediator that allows the gel to perform its protective role without causing adhesive contamination.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Stability of the object's composition

If gel flows out to reach adhesive portions, then connectivity is maintained, but connecting strength deteriorates

Engineering Contradiction:
Improvecomponent connectivityVSAvoidadhesive connecting strength
Core Design Contradiction:
Stability of the object's compositionVSStrength

Solution Approach 1:

The bank structure is positioned and designed in advance to prevent gel from reaching the adhesive portions before the adhesive can properly bond. By establishing this preliminary protective barrier, the harmful effect of gel contamination on adhesive strength is prevented from occurring in the first place, while component connectivity is maintained through proper structural design.

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively prevents gel from flowing out while maintaining a compact sensor size, enhancing the connecting force of adhesives and reducing manufacturing costs by containing the gel within the designated banks.

Implementation Method 1

the gel is prevented from creeping up the bank due to its capillary action by the curved concave surfaces

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS7768124B2Semiconductor sensor having a flat mounting plate with banks
Publication Date: 2010.08.03 DENSO CORP
  • US7768124B2 patent drawing
  • US7768124B2 patent drawing
  • US7768124B2 patent drawing

AI summary

A semiconductor sensor is contained in a cylindrical housing, an opening of which is closed with a cover member. The cover member includes a mounting plate integrally molded therewith. Components including a bare sensing chip and other circuit chips are directly mounted on a flat surface of the mounting plate. The components mounted on the flat surface are covered with gel having a high flowability. The gel is prevented from flowing out of the flat surface toward the cover member by banks formed at both sides of the flat surface. On an inner wall of the bank, curved surfaces and depressions are formed to surely suppress creeping up of the gel and to trap the gel therein if it creeps up the inner wall of the bank. Thus, the gel is surely prevented from flowing out even though the banks do not entirely surround the flat mounting surface.