Sensor Device Mounting Leads for Precise Angle Alignment

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Solution Overview

Problem

Existing sensor devices face challenges in accurately determining the mounting angle of sensor elements with respect to the substrate, leading to detection sensitivity and error issues due to angular differences, and require complex lead arrangements and dedicated substrates, which increase manufacturing costs and risk short-circuits.

Innovation Solution

A sensor device design featuring mounting leads with one-end and other-end parts folded to form a planar shape, allowing for precise angle determination by the intermediate part's shape, eliminating the need for dedicated substrates and reducing lead complexity, while preventing short-circuits through strategic bending of the other-end parts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If mounting leads are folded to maintain a tilted state of the sensor component, then the detection sensitivity and detection error are improved, but the mounting angle variation causes bending angle variation and handling difficulty

Engineering Contradiction:
Improvedetection sensitivityVSAvoidmounting leads arrangement
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The mounting leads are divided into three distinct segments: a first end part folded to connect to connection terminals, an intermediate part extending toward the mounting surface, and a second end part folded to be externally exposed. This segmentation allows each part to serve a specific function while maintaining overall simplicity and precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mounting leads utilize three-dimensional folding in multiple directions to achieve the tilted mounting angle. By bending the leads in different dimensions (first end part folded in one direction, second end part folded in another direction), the sensor component is tilted relative to the mounting surface without increasing planar complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If the tilt angle of the sensor element is increased, then the detection axis alignment is improved, but the mounting leads are exposed to the top of the resin part making handling difficult

Engineering Contradiction:
Improvedetection axis alignmentVSAvoidhandling in transferring
Core Design Contradiction:
Measurement precisionVSEase of operation

Solution Approach 1:

The mounting leads are segmented into parts that remain embedded in the resin and parts that are externally exposed. The first end part and intermediate part remain within the resin for stability, while only the necessary second end part is exposed for connection, optimizing both alignment and handling.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The resin part acts as an intermediary that supports and protects the mounting leads. The resin embeds the first end part and intermediate part while allowing the second end part to be exposed, thus mediating between the need for tilted alignment and easy handling.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Measurement precision

If software correction is used for angular difference, then the detection error is reduced within correctable range, but large angular differences exceed the correctable range

Engineering Contradiction:
Improvedetection error reductionVSAvoidcorrectable range
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The mounting leads are pre-folded to tilt the sensor component at a specific angle before mounting. This preliminary mechanical adjustment ensures that the detection axis is properly aligned with the mounting surface, preventing large angular differences that would exceed software correction capabilities.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS8701485B2Sensor device
Publication Date: 2014.04.22 SEIKO EPSON CORP
  • US8701485B2 patent drawing
  • US8701485B2 patent drawing
  • US8701485B2 patent drawing

AI summary

A sensor device includes: a sensor component including a package, connection terminals including first connection terminals on a terminal forming surface of the package and a sensor element housed in the package; a resin part covering the sensor component; and mounting leads including a one-end part coupled to one first connection terminal in the resin part so that a main surface thereof faces a main surface of the one first connection terminal face; an intermediate part extending toward a mounting surface of the sensor device from the one-end part; and another-end part externally exposed from the resin part. The sensor component is tilted or orthogonal relative to the mounting surface. The connection terminals are provided along one of the sides forming an outline of the terminal forming surface, the one side being tilted or orthogonal with respect to the mounting surface. The intermediate part includes an angled part.