Sensor Package Conductive Adhesive Electrical Connection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sensor packages face challenges in providing cost-effective and reliable manufacturing methods for sensors that require partial exposure to the environment, such as gas sensors, while ensuring reliable electrical connections and protection from harsh conditions.
Innovation Solution
A sensor package design featuring a substrate with a first sensor element and electrically conductive glue connections to lead frame members, allowing for aperture exposure and integration with electronic components, enabling reliable and cost-effective manufacturing through encapsulation technology and wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are used to connect sensor elements to lead frame members, then electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces the mechanical bonding wire system with an electrically conductive adhesive system. Instead of using wire bonds that require precise alignment and bonding equipment, the invention uses a printed circuit board with conductive traces and electrically conductive adhesive to create electrical connections between the sensor element and lead frame members, significantly simplifying the manufacturing process while maintaining reliable electrical connectivity
Solution Approach 2:
The invention changes the connection method from mechanical (wire bonding) to chemical/adhesive-based (electrically conductive adhesive). This parameter change in the connection mechanism allows for lower manufacturing complexity and cost while achieving the same electrical connection function, as the adhesive can be applied using standard PCB fabrication processes
2Object-affected harmful factors
If the sensor element is fully enclosed in the package body, then protection from harsh environments is improved, but exposure to the sensing environment is reduced
Solution Approach 1:
The patent applies local quality by creating a selective exposure design where only the sensitive surface of the sensor element that requires environmental interaction is exposed through an aperture in the package body, while all other surfaces of the sensor element and the substrate are fully enclosed and protected. This allows the sensor to maintain protection from harsh conditions while still enabling necessary exposure to the sensing environment for accurate measurements
3Ease of manufacture
If traditional encapsulation methods are used, then manufacturing cost is reduced, but manufacturing precision and reliability of electrical connections deteriorate
Solution Approach 1:
The patent merges the electrical connection function with the package structure by integrating conductive traces directly into the printed circuit board substrate. This consolidation eliminates the need for separate connection components and processes, achieving both cost-effectiveness through simplified manufacturing and high precision through controlled PCB trace routing and placement
Solution Approach 2:
The invention replaces traditional mechanical connection methods (wire bonding, tab bonding) with a printed circuit board-based electrical connection system using conductive traces and adhesive. This substitution enables standard PCB manufacturing processes to be used, improving both manufacturing precision through controlled trace geometry and maintaining cost-effectiveness through high-volume PCB fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach facilitates cost-effective high-volume production of advanced sensor packages with reliable electrical connections, protecting sensors in harsh environments and enabling accurate measurements across varying conditions.
Implementation Method 1
an electrically conductive glue connection between contact terminals of the first sensor element and one or more of the plurality of lead frame members
Implementation Method 2
the one or more electronic components are electrically connected by means of bonding wires to further ones of the plurality of lead frame members
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
An integrated circuit sensor package (1) with a package body (5) moulded at least in part around a substrate (2) and a plurality of lead frame members (6, 8). The substrate (2) has a first sensor element (3) on a first side surface (2a). The package body (5) comprises an aperture (5a) exposing a sensitive surface (4) of the first sensor element (3). Electrically conductive glue connections (7, 9) are provided between contact terminals of the first sensor element (3) and one or more of the plurality of lead frame members (6, 8).