Image Sensor Package with Casing Vent and Adhesive Seal
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Solution Overview
Problem
Conventional image sensor packaging technologies are costly due to the use of expensive liquid compounds and are prone to moisture invasion, leading to reduced reliability and production yield due to volatile gases and crevice formation during baking.
Innovation Solution
An image sensor package structure featuring a transparent lid covered by adhesive layers and a casing with gas vents, which reduces the amount of expensive liquid compound used and prevents moisture invasion by elongating the blockage area and allowing volatile gases to escape, thereby enhancing structural reliability and imaging quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid compound is used to package image sensor for preventing moisture invasion, then moisture protection is improved, but material cost increases significantly
Solution Approach 1:
The patent applies local quality by using adhesive layers specifically at the periphery where moisture invasion occurs, rather than using expensive liquid compound throughout the entire package. The adhesive layers are strategically positioned to block moisture at critical entry points while keeping material costs low.
Solution Approach 2:
The patent uses thin adhesive layers as flexible sealing elements to prevent moisture invasion. These thin film adhesive layers provide effective moisture protection at the periphery without requiring large quantities of expensive liquid compound material.
2Ease of manufacture
If liquid compound is used during baking process, then packaging is achieved, but volatile gases create crevices reducing reliability
Solution Approach 1:
The patent extracts the problematic volatile gases from the system by providing gas vents in the casing structure. This allows gases to escape during the baking process, preventing crevice formation and maintaining structural integrity while still enabling the packaging process to proceed.
Solution Approach 2:
The patent converts the harmful effect of volatile gases into a beneficial outcome by designing gas vents that channel gas escape. The gas vents transform the potential damage from gas expansion into a controlled release mechanism that actually improves reliability by preventing crevice formation.
3Reliability
If liquid compound is used for packaging, then moisture protection is provided, but production yield decreases due to moisture invasion
Solution Approach 1:
The patent uses adhesive layers positioned at critical moisture entry points rather than relying on liquid compound throughout. This localized approach provides effective moisture protection while avoiding the reliability issues that reduce production yield, thereby improving both protection and productivity.
4Volume of moving object
If transparent lid adheres directly to chip, then compact structure is achieved, but imaging quality is reduced due to small air cavity
Solution Approach 1:
The patent introduces an intermediate casing structure that adds a dimensional layer between the transparent lid and the chip. This intermediate structure enlarges the air cavity volume in the vertical dimension while maintaining the compact horizontal footprint, thus improving imaging quality without significantly increasing overall package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces material costs, improves the reliability of the image sensor package structure by preventing moisture invasion and volatile gas buildup, and enhances imaging quality by enlarging the air cavity between the transparent lid and the chip.
Implementation Method 1
a transparent lid having a third surface and a fourth surface opposite to the third surface, wherein the third surface adheres to the second surface for covering over the sensitization area
Implementation Method 2
a casing provided with at least one gas vent that allows volatile gases contained in the liquid compound to escape during compound dispensing or post mold cure
Implementation Method 3
a package material covering around the chip, the transparent lid, and the first casing at peripheries thereof
Data Source
AI summary
The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.