Sensor Integrated Package Cavity Magnet Seal
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Solution Overview
Problem
Current microelectronic sensor packages face challenges in achieving higher precision and functionality due to limitations in miniaturization, particularly in the integration of sensors like accelerometers and gyroscopes, where the demand for smaller package sizes and improved performance has not been fully met by existing technologies.
Innovation Solution
A microelectronic sensor integrated package structure is developed, featuring a substrate with conductive traces, a cavity formed between these traces, and a magnet placed on resist material, which seals the cavity, allowing for the integration of sensors like accelerometers and gyroscopes with coreless and standard substrate techniques, enabling precise measurement of acceleration and angular velocity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If sensors are packaged together in a manner similar to an integrated chip package or integrated as part of a substrate build, then the package size is reduced, but the precision and functionality of the sensor devices are compromised
Solution Approach 1:
The package structure is segmented into distinct functional layers: a substrate layer containing conductive traces, a cavity layer formed between the traces, and a seal layer. This segmentation allows each layer to be optimized independently - the cavity can be precisely positioned for sensor functionality while the overall structure maintains miniaturization, resolving the contradiction between small package size and high measurement precision
Solution Approach 2:
The invention transitions from planar integration to three-dimensional structuring by forming cavities between conductive traces on opposite sides of the substrate. This vertical dimensionality change enables precise sensor positioning and magnetic field confinement without increasing the lateral package footprint, thereby achieving both miniaturization and high precision simultaneously
2Ease of manufacture
If the cavity spacing between substrate and package lid is created by a resin spacer layer, then the structure is simplified, but the precision and functionality of integrated sensors are limited
Solution Approach 1:
The conductive traces serve multiple functions: they provide electrical connectivity for the sensor elements and simultaneously define the cavity boundaries through their positioning on opposite sides of the substrate. This multi-functionality eliminates the need for separate spacer structures while maintaining precise cavity geometry, thereby achieving both manufacturing simplicity and sensor precision
Solution Approach 2:
The invention merges the electrical interconnect function with the mechanical cavity definition function into a single structural feature - the conductive traces. By combining these functions, the design eliminates redundant components like resin spacers, simplifying manufacturing while preserving the precision required for sensor operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of high-precision sensor packages with reduced size, providing effective measurement capabilities for acceleration and angular velocity, enhancing the functionality and precision of microelectronic sensor devices.
Implementation Method 1
Translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. The magnetic field is due to a permanent magnet placed on the base of a cavity
Implementation Method 2
Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. The vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity
Data Source
Figure 1
Figure 2
Figure 3a~3b
AI summary
Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.