Pressure Sensor Package Channel Layout for Condensation Suppression
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Solution Overview
Problem
Conventional semiconductor packages experience condensation issues due to vapor cooling near the sensor chip, leading to corrosion and short-circuits in the connector terminals, as the temperature of the connector pin heat sink is lower than the components in the outer case.
Innovation Solution
A semiconductor package design with a lead frame actively heated by the pressure medium, featuring channels that guide the medium to dissipate heat through the case body, suppressing condensation by maintaining the lead frame temperature higher than the sensor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the pressure medium is guided directly to the pressure detection chamber, then the response speed is improved, but condensation occurs near the lead frame causing corrosion and short-circuits
Solution Approach 1:
The pressure medium flow path is segmented into multiple sections: a first channel guides the medium to the lead frame area for heating, while a second channel guides it to the pressure detection chamber. This segmentation allows the medium to sequentially perform different functions (heating then pressure detection) without direct contamination of electrical components.
Solution Approach 2:
The pressure medium itself serves as an intermediary heat transfer medium. It absorbs heat from the heating unit in the first channel, warms the lead frame indirectly through thermal coupling, then proceeds to the pressure detection chamber. This intermediary role prevents direct contact between the cold medium and electrical components while still achieving the desired heating effect.
2Reliability
If the lead frame is heated to prevent condensation, then condensation is suppressed, but energy consumption increases
Solution Approach 1:
The pressure medium serves a dual function: it is both the target of pressure detection and the medium for heat transfer. As the medium flows through the first channel, it absorbs heat from the heating unit and automatically uses this thermal energy to warm the lead frame area, eliminating the need for a separate heating system and reducing overall energy consumption.
Solution Approach 2:
The pressure medium performs multiple functions simultaneously: it is heated in the first channel, acts as a heat transfer medium to warm the lead frame, and then serves as the pressure detection target in the pressure detection chamber. This multi-functionality reduces the need for additional components and energy input.
3Temperature
If the channel passes through the lead frame vicinity, then the lead frame temperature is maintained higher, but the structure becomes more complex
Solution Approach 1:
The first and second channels are merged into a single integrated channel structure that passes through the bottom wall. The channel is designed with branching sections that allow the pressure medium to sequentially access different functional areas (heating zone near lead frame, then pressure detection chamber) without requiring separate independent channels, thereby simplifying the overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Suppresses condensation in the pressure detection chamber, preventing corrosion and short-circuits, while maintaining measurement accuracy by reducing vapor content in the medium before it reaches the sensor chip.
Implementation Method 1
the channel extending from the first end of the pressure intake part and passing through a vicinity of the lead frame, to thereby guide the pressure medium from the first end of the pressure intake part to the pressure detection chamber, such that the pressure medium applies the pressure to the pressure sensor chip
Implementation Method 2
a pressure sensor chip housed in the pressure detection chamber and configured to convert a pressure applied thereto into an electrical signal
Data Source
AI summary
A semiconductor package for detecting a pressure of a pressure medium flowing through a pipe. The semiconductor package includes: a case body having a pressure detection chamber; a pressure sensor chip housed in the pressure detection chamber and configured to convert a pressure applied thereto into an electrical signal; a lead frame insert-molded in the case body and electrically connected to the pressure sensor chip; and a pressure intake part having a first end protruding externally from a bottom of the case body, and a second end spatially connected to the pipe. The case body has a channel that extends from the first end of the pressure intake part and passes through a vicinity of the lead frame, to thereby guide the pressure medium from the first end of the pressure intake part through the channel to the pressure detection chamber, to apply the pressure to the pressure sensor chip.