Sensor Package Coplanar Padding Layer Wire Break Reduction
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Solution Overview
Problem
Conventional sensor package structures are prone to wire-break issues due to height differences between the substrate and sensor chip, which worsen with increasing sensor chip thickness, leading to longer wire arcs and increased breakage probabilities.
Innovation Solution
A sensor package structure that includes a substrate, a sensor chip, a padding layer with bonding regions electrically coupled to the substrate, and wires embedded in a support, where the padding layer is coplanar with the sensor chip, reducing the influence of height differences on wire length and breaking probability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional package structure is used with substrate and sensor chip at different heights, then manufacturing is simpler, but wire-break issues occur easily due to height difference
Solution Approach 1:
The coplanar layer serves as a mediator that reconciles the manufacturing simplicity of conventional structures with the reliability needs. It is formed on the substrate and provides bonding regions at the appropriate height, maintaining a relatively simple manufacturing process while solving the wire-break issue. The coplanar layer acts as an intermediate structure that enables reliable wire connections without requiring complex reconfiguration of the entire package structure.
2Length of stationary object
If wires are made longer to accommodate height difference, then connection between substrate and sensor chip is achieved, but wire arc length increases leading to higher wire-break probability
Solution Approach 1:
The coplanar layer provides intermediate bonding regions that are positioned at the same height as the sensor chip, creating optimal connection points for the wires. This intermediary structure allows wires to connect from the substrate to the coplanar layer with minimized arc length, as the bonding regions are strategically positioned to match the sensor chip top surface level. The coplanar layer thus serves as an optimal connection interface that reduces wire length and breakage risk.
Data Source
AI summary
A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a padding layer disposed on the substrate, a plurality of wires, a support, and a light-permeable layer disposed on the support. A top side of the padding layer is coplanar with a top surface of the sensor chip, the support is disposed on the top side of the padding layer and the top surface of the sensor chip, and the wires are embedded in the support. Terminals at one end of the wires are connected to the top surface of the sensor chip, and terminals at the other end of the wires are connected to the top side of the padding layer, so that the sensor chip can be electrically coupled to the substrate through the wires and the padding layer.