Sensor Package With Differential Deformation Regions
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Solution Overview
Problem
Existing methods for measuring mechanical tension and loads often require destroying the material or are not efficient in detecting mechanical stress, particularly in applications like steering rods and equipment operation, where torsion, torque, or bending need to be detected.
Innovation Solution
A sensor arrangement featuring a chip with a sensor circuit configured to detect bending, housed in a package structure with distinct regions that allow for differential deformation, enabling the chip to measure mechanical stress while being protected from excessive loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the package structure is made rigid to protect the chip, then the protection capability is improved, but the sensitivity of the sensor to detect bending is reduced
Solution Approach 1:
The package structure is divided into a rigid portion and a flexible portion, allowing each region to serve different functions. The rigid portion provides protection while the flexible portion enables bending detection, resolving the contradiction between protection capability and sensitivity.
Solution Approach 2:
Different regions of the package structure are assigned different mechanical properties. The first region (rigid portion) has high stiffness for protection, while the second region (flexible portion) has low stiffness for sensitivity, allowing local optimization of both protection and detection capabilities.
2Measurement precision
If the chip is made more sensitive to detect small bending, then the measurement precision is improved, but the chip becomes more vulnerable to damage from excessive loads
Solution Approach 1:
The flexible portion of the package structure acts as an intermediary between the external environment and the chip. It transmits bending forces to the chip for detection while absorbing excessive loads, thereby protecting the chip from damage while maintaining sensitivity.
Solution Approach 2:
The flexible portion serves as a pre-configured cushioning element that protects the chip from excessive loads before they can cause damage. This allows the chip to operate at high sensitivity without being vulnerable to mechanical failure.
3Adaptability or versatility
If a complex package structure is used to provide both protection and differential deformation, then the functionality is improved, but the manufacturing complexity increases
Solution Approach 1:
The package structure achieves differential deformation by changing the physical parameters (thickness, material properties) of different regions rather than using completely different structural configurations. This allows complex functionality to be achieved through parameter variation rather than structural complexity.
Solution Approach 2:
The package structure uses composite construction with different material properties in different regions (rigid and flexible portions). This allows the structure to exhibit both protection and differential deformation capabilities while maintaining a relatively simple overall form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sensor arrangement effectively measures mechanical stress and loads by utilizing a package structure that can deform differently, enhancing the sensitivity and durability of the chip, allowing for continuous monitoring of materials and detecting mechanical stress without damaging the sensor chip.
Implementation Method 1
a chip (402) including a sensor circuit (404) configured to detect a bending of the chip
Implementation Method 2
the package structure includes a first region (412) and a second region (414), and wherein the package structure is configured such that it is easier to be deformed in the first region (412) than in the second region (414)
Data Source
AI summary
A sensor arrangement is provided, the sensor arrangement including a chip including a sensor circuit configured to detect a bending of the chip; and a package structure configured to protect the chip; wherein the package structure includes a first region and a second region, and wherein the package structure is configured such that it is easier to be deformed in the first region than in the second region.