Semiconductor package, wearable device, and temperature detection method
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Solution Overview
Problem
Wearable devices with sensing functions face challenges in integrating multiple components within the constraints of limited footprint and power consumption, while also requiring accurate temperature detection and distance measurement.
Innovation Solution
A semiconductor package is designed with a substrate, an optical module for distance detection, and a temperature module that includes a semiconductor element and a temperature sensor, allowing for precise temperature calibration based on detected distance information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple sensing components are integrated in a wearable device, then the functionality is enhanced, but the device footprint increases
Solution Approach 1:
The patent combines the optical module and temperature module into a single semiconductor package with shared substrate and integrated structure. The optical module includes light emitter and light receiver, while the temperature module includes temperature sensor and semiconductor element, all integrated on the same substrate to reduce overall device footprint while maintaining multiple sensing functions.
Solution Approach 2:
The temperature module is positioned adjacent to and partially overlapping with the optical module footprint. The semiconductor element is stacked on the temperature sensor, creating a nested vertical arrangement that maximizes space utilization and reduces the horizontal footprint of the integrated sensing package.
2Area of stationary object
If optical module and temperature sensor are integrated closely, then footprint is reduced, but cross-talk between sensors increases
Solution Approach 1:
The semiconductor element is positioned between the light emitter and the temperature sensor, acting as a physical barrier or intermediary structure that blocks or attenuates light from reaching the temperature sensor. This prevents optical cross-talk while maintaining the compact integrated structure of the semiconductor package.
Solution Approach 2:
The semiconductor package is divided into distinct functional modules (optical module and temperature module) with clear spatial separation. The light emitter, light receiver, temperature sensor, and semiconductor element are positioned in specific regions of the substrate to minimize interference between modules while maintaining integration benefits.
3Ease of manufacture
If temperature sensor is placed near light emitter, then integration is improved, but light interference with temperature detection occurs
Solution Approach 1:
The semiconductor element serves as an intermediary barrier positioned between the light emitter and temperature sensor. This structure physically blocks light paths that would otherwise interfere with temperature detection, allowing the modules to remain closely integrated for manufacturing efficiency while protecting measurement precision.
Solution Approach 2:
The semiconductor package employs localized light blocking structures (the semiconductor element) specifically positioned where light interference would occur. This targeted approach allows the temperature sensor to operate accurately in proximity to the light emitter without requiring complete separation of the modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor package effectively integrates multiple sensing functions, reducing cross-talk between optical and temperature sensors, and enabling accurate temperature detection of objects by calibrating based on measured distance, thus enhancing the functionality of wearable devices.
Implementation Method 1
The optical module is configured to detect a distance between the optical module and an object
Implementation Method 2
The optical module is configured to detect a distance between the optical module and an object
Implementation Method 3
generating a data by the temperature sensor associated with a temperature of an object
Implementation Method 4
The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element
Implementation Method 5
calibrating the detected temperature of the object based on the data, the detected temperature of the temperature sensor, and the measured distance
Implementation Method 6
The temperature module is configured to prevent a portion of the first light from reaching the light receiver
Data Source
AI summary
A semiconductor package device, a wearable device, and a temperature detection method are provided. The semiconductor package includes a substrate, an optical module, and a temperature module. The optical module is disposed on the substrate. The temperature module is disposed on the substrate and adjacent to the optical module. The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element. The optical module is configured to detect a distance between the optical module and an object.