Image Sensor Package Edge Dam for Compact Contamination Control
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Solution Overview
Problem
Semiconductor packages with image sensors face challenges in achieving a balance between small size, high reliability, low power consumption, multi-functionality, high-speed data processing, and cost-effectiveness while maintaining clear image quality, especially in compact electronic devices.
Innovation Solution
A semiconductor package design that includes a package substrate, an image sensor chip with a pixel array region and pad region, a transparent substrate, and a dam structure on the edge of the image sensor chip between the chip and the transparent substrate, along with a lens structure and micro lenses, which enhances reliability and prevents contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the image sensor chip size is reduced to achieve compact electronic devices, then the device size is reduced, but the reliability and image quality may deteriorate
Solution Approach 1:
The patent applies local quality by implementing a dam structure specifically at the edge of the image sensor chip where contamination risks are highest, rather than uniformly across the entire chip. The dam structure is positioned between the image sensor chip and transparent substrate at the edge region, providing localized protection against contaminant ingress while maintaining overall compact dimensions. This localized approach ensures reliability at critical areas without increasing overall package size.
2Reliability
If the dam structure is added to prevent contaminant ingress, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The dam structure serves as an intermediary element between the image sensor chip and the transparent substrate. This intermediate structure prevents direct contact between the two components at the edge region, blocking the pathway for contaminant ingress. The dam structure is formed as a separate layer that mediates the interface between chip and substrate, providing protection without requiring fundamental redesign of the existing bonding structure.
Solution Approach 2:
The patent segments the interface between the image sensor chip and transparent substrate by introducing a dam structure at the edge region. This segmentation creates distinct functional zones: the central bonding area for electrical and mechanical connection, and the peripheral dam structure for contamination protection. By dividing the interface into these functional segments, the patent achieves contaminant protection without compromising the bonding integrity in the central region.
3Manufacturing precision
If the lens structure is disposed on the light blocking pattern, then the image quality is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The light blocking pattern is formed on the image sensor chip before the lens structure is disposed on top of it. This preliminary formation of the light blocking pattern creates a predefined alignment reference that guides the subsequent placement of the lens structure. The lens structure is positioned relative to the already-formed light blocking pattern, ensuring proper alignment without requiring simultaneous high-precision fabrication of both elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact and reliable semiconductor package with improved image quality and protection from external contaminants, addressing the need for small size and high performance in electronic devices.
Implementation Method 1
micro lenses on the color filters, and a lens structure on the light blocking pattern and surrounding the light receiving region
Data Source
AI summary
A semiconductor package includes a package substrate, an image sensor chip on the package substrate, a transparent substrate on the image sensor chip, and a dam structure on an edge of the image sensor chip and between the image sensor chip and the transparent substrate. The image sensor chip includes a semiconductor substrate including a pixel array region and a pad region around the pixel array region, the pixel array region including a light receiving region and a light blocking region between the light receiving region and the pad region, color filters on the light receiving region of the semiconductor substrate, a light blocking pattern on the light blocking region of the semiconductor substrate, micro lenses on the color filters, and a lens structure on the light blocking pattern and surrounding the light receiving region. The dam structure may be on at least a portion of the lens structure.