Pressure Sensor Package Edge Port Structure for Cleaner Venting
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Solution Overview
Problem
Conventional semiconductor packages for pressure sensors have vents that allow contaminants to enter the central cavity, impairing the function of sensitive semiconductor dies and causing damage from debris and tooling.
Innovation Solution
The package design incorporates channels or vents formed on the sides of the package, allowing airflow while reducing contamination by preventing debris entry and enhancing resilience to plugging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vents are provided in the package to allow media to pass through, then pressure sensing function is enabled, but contaminants can enter the central cavity and impair semiconductor die function
Solution Approach 1:
The patent applies local quality by providing different surface characteristics at different locations of the package. Specifically, the top surface (first surface) is made non-planar with protrusions that create restricted airflow paths, while the bottom surface (second surface) remains planar. This localized differentiation allows the top surface to filter contaminants while still permitting pressure media to reach the sensing cavity, thus resolving the contradiction between enabling pressure sensing and preventing contaminant entry.
2Ease of operation
If conventional vents are used, then airflow is achieved, but debris and tooling can cause damage to sensitive semiconductor dies
Solution Approach 1:
The patent implements preliminary anti-action by pre-configuring the top surface with protrusions that create a protective barrier before contaminants can reach the semiconductor dies. These protrusions are formed during the molding process to preemptively block debris and tooling from entering the central cavity, while still allowing pressure media to pass through to the sensing elements. This preventive structure resolves the contradiction by protecting sensitive components while maintaining airflow functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The side-vent design maintains package functionality by ensuring adequate airflow while minimizing contamination, thus protecting the semiconductor dies and improving device accuracy and durability.
Implementation Method 1
the top surface (first surface) is non-planar and includes a plurality of protrusions that collectively restrict airflow paths between the top surface and the central cavity
Data Source
AI summary
A semiconductor device may include a semiconductor die mounted on a substrate. A semiconductor device may include a body portion of a semiconductor package including a plurality of walls configured to define a cavity. A semiconductor device may include a package lid having a plurality of channels formed in a bottom surface of the package lid and the bottom surface of the package lid is mounted to a top surface of the body portion of the semiconductor package. A semiconductor device may include a vent or a plurality of vents that exposes the cavity of the semiconductor package to ambient air and other media exterior the semiconductor package.