Semiconductor Package Depression Around Sensor Exposure Hole
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Solution Overview
Problem
Semiconductor devices with resin packages face a reduction in detection performance due to the resin material covering the detection elements, which affects the functionality of sensors and other detectors.
Innovation Solution
Incorporating an exposure hole in the resin package with a depressed portion along the outer peripheral edge of the detector's surface, allowing only a portion of the outer peripheral edge to be exposed, and using a mold release film to prevent resin material from covering the detection portion during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin package is provided to cover the detector, then the detector is protected and packaged, but the detection performance is reduced due to the resin material covering the detection portion
Solution Approach 1:
The resin package is segmented into different regions: a first region that covers part of the detector for protection, and a second region with an exposed portion that leaves the detection portion uncovered. This segmentation allows simultaneous achievement of protection and detection performance by having different functional zones within the same package structure.
Solution Approach 2:
The resin package exhibits local quality variation where different portions have different coverage characteristics. The first portion provides full coverage for protection, while the second portion has reduced coverage to maintain detection performance. This local differentiation resolves the contradiction by optimizing each region for its specific function.
2Measurement precision
If the detection portion is exposed to maintain detection performance, then detection performance is maintained, but the detector becomes vulnerable to environmental factors
Solution Approach 1:
The detector surface is segmented into a covered region and an exposed region. The exposed region maintains detection performance while the covered region provides protection. This spatial segmentation allows both contradictory requirements to be satisfied simultaneously in different areas.
Solution Approach 2:
Different portions of the detector receive different levels of protection through the resin package. The detection portion has local quality of exposure for performance, while other portions have local quality of coverage for protection. This local differentiation resolves the contradiction.
3Ease of manufacture
If the resin package covers the entire detector, then packaging is simplified, but detection performance is reduced
Solution Approach 1:
The packaging process is segmented into stages or zones, with the mold cavity designed to produce a resin package with distinct covered and exposed regions. This segmentation maintains manufacturing simplicity while achieving the complex functional requirement of partial coverage.
Solution Approach 2:
The resin package is designed with local quality variation in its coverage pattern. The mold cavity geometry is configured to create regions of different coverage density, allowing simplified single-step manufacturing that produces the differentiated protection levels needed for both ease of manufacture and detection performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces or prevents the reduction in detection performance by ensuring the detection portion remains exposed and functional, while minimizing the resin package's impact on the detector's operation.
Implementation Method 1
bringing a mold release film into close contact with a mold that includes a cavity with a projection
Implementation Method 2
filling the cavity of the mold with a melted resin material, separating the mold and the mold release film from the resin package that includes a solidified resin material
Data Source
AI summary
A semiconductor device includes a base, a detector on the base and including a first surface on which a detection portion is provided, and a resin package on the base and including an exposure hole to externally expose the detection portion of the detector. At least a portion of an outer peripheral edge of the first surface of the detector is exposed in the exposure hole. The resin package includes a depressed portion along the portion of the outer peripheral edge that is exposed in the exposure hole.