Sensor Package Structure With Roughened Ring to Reduce Flare

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Solution Overview

Problem

Conventional sensor package structures experience light reflection issues, leading to flare phenomena at the sensing region due to light passing through a light-permeable layer.

Innovation Solution

A sensor package structure is designed with a substrate, sensor chip, metal wires, and a light-permeable layer featuring an inner ring-shaped roughened region on its surface, which scatters light to prevent reflection onto the sensing region, thereby reducing flare effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a light-permeable layer is used to allow light to reach the sensor chip, then light transmission is improved, but light reflection causing flare phenomenon occurs

Engineering Contradiction:
Improvelight transmissionVSAvoidlight reflection
Core Design Contradiction:
Illumination intensityVSObject-affected harmful factors

Solution Approach 1:

The light-permeable layer is divided into two regions with different surface properties: a smooth transparent region over the sensing area that maintains high light transmission, and a roughened region over the non-sensing area that reduces light reflection. This local differentiation resolves the contradiction by allowing light transmission where needed while preventing reflection where it causes harm.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The roughened region acts as an intermediary element that intercepts and scatters light before it can reflect off metal wires into the sensing region. This mediator structure prevents the harmful reflection pathway while maintaining the light-permeable layer's overall transparency function.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If metal wires are used to electrically connect the substrate and sensor chip, then electrical coupling is achieved, but light reflection from metal wires causes flare at the sensing region

Engineering Contradiction:
Improveelectrical couplingVSAvoidlight reflection
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The roughened region is strategically positioned to cover the metal wires, converting the harmful reflective property of the metal wires into a beneficial light-scattering function. The roughened surface diffuses light that would otherwise reflect directly into the sensing region, thereby eliminating the flare problem while preserving the electrical connection function.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Illumination intensity

If the light-permeable layer is made fully transparent to maximize light transmission, then light reaching the sensor is improved, but flare phenomenon increases due to uncontrolled light paths

Engineering Contradiction:
Improvelight transmissionVSAvoidsensing accuracy
Core Design Contradiction:
Illumination intensityVSMeasurement precision

Solution Approach 1:

The light-permeable layer implements spatially varying optical properties: the transparent smooth region maximizes light transmission to the sensing area, while the roughened region controls light paths to prevent flare. This local quality differentiation resolves the contradiction between maximizing light transmission and maintaining measurement precision.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The inner ring-shaped roughened region effectively reduces light reflection onto the sensing region, improving the performance of the sensor package structure by minimizing flare phenomena.

Implementation Method 1

light arriving on the inner ring-shaped roughened region by passing through the light-permeable layer can be scattered to prevent the light from being reflected to the sensing region

Methodology Applied
Scientific EffectLight scattering: Scattering

Data Source

PatentUS12177996B2Sensor package structure
Publication Date: 2024.12.24 TONG HSING ELECTRONICS IND LTD
  • US12177996B2 patent drawing
  • US12177996B2 patent drawing
  • US12177996B2 patent drawing

AI summary

A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically coupling the substrate and the sensor chip, a frame fixed on the substrate, and a light-permeable layer that is disposed on the frame. The light-permeable layer has a transparent segment and a ring-shaped segment that surrounds the transparent segment. The ring-shaped segment is disposed on a top end surface of the frame, so that the light-permeable layer, the frame, and the substrate jointly define an enclosed space that accommodates the sensor chip and the metal wires therein. The ring-shaped segment has an inner ring-shaped roughened region that is arranged on an inner surface thereof and that is fixed onto the top end surface of the frame. Moreover, an inner edge of the inner ring-shaped roughened region is arranged in the enclosed space.