Sensor Package Lens Layout to Suppress Flare in Compact Imagers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to achieve downsizing and height reduction of solid-state imaging elements while minimizing the occurrence of flare due to total internal reflection in camera systems, particularly in mobile terminal devices and digital still cameras.
Innovation Solution
A sensor package configuration that includes a solid-state imaging element, a circuit board, a sensor package substrate, and a lens formed on the lower surface of the substrate, where the lens is integrated with the sensor package holding component to prevent flare by positioning it between the substrate and the imaging element, and a method of manufacturing this package by filling a predetermined opening with lens material and molding it to bond the components simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the lowermost lens is formed on the solid-state imaging element to achieve downsizing and height reduction, then device size and height are reduced, but flare occurs due to total internal reflection of the lowermost lens
Solution Approach 1:
Instead of forming the lowermost lens directly on the solid-state imaging element, the patent inverts the arrangement by forming the lowermost lens on the sensor package substrate (incident light side) of the solid-state imaging element. This positional inversion prevents total internal reflection while maintaining the downsizing benefit, as the lens is still integrated close to the imaging element but on the opposite side of the interface.
2Length of stationary object
If the lowermost lens is formed on the solid-state imaging element, then height reduction is achieved, but total internal reflection causes flare
Solution Approach 1:
The patent applies inversion by relocating the lowermost lens from the imaging element side to the sensor package substrate side (incident light side). This maintains the compact height configuration while eliminating the optical interface that causes total internal reflection and flare.
3Object-generated harmful factors
If the lens is formed on the incident light side of the solid-state imaging element, then flare is suppressed, but manufacturing complexity increases
Solution Approach 1:
The patent merges the lens formation process with the sensor package substrate manufacturing process. The lowermost lens is formed integrally with the sensor package substrate on the incident light side, combining two components into one manufacturing step. This reduces overall manufacturing complexity despite the unconventional lens positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses flare occurrence while enabling device miniaturization and height reduction, maintaining optical characteristics and improving sensitivity by preventing total internal reflection.
Implementation Method 1
a solid-state imaging element that generates a pixel signal by photoelectric conversion in accordance with a light amount of incident light
Implementation Method 2
a lens unit including a lens group focusing incident light on a light receiving surface of a solid-state imaging element
Implementation Method 3
molding the lens material by a mold of a lens and curing the molded lens material to simultaneously bonding the sensor package substrate, the sensor package holding component, and the lens to each other
Data Source
AI summary
The present disclosure relates to a sensor package, a method of manufacturing the same, and an imaging device that can achieve downsizing and height reduction and suppress occurrence of a flare. A sensor package includes: a solid-state imaging element that generates a pixel signal by photoelectric conversion in accordance with a light amount of incident light; a circuit board electrically connected to the solid-state imaging element; a sensor package substrate that is arranged on an incident light side of the solid-state imaging element and brings the solid-state imaging element into a sealed state; and a lens formed on a lower surface of the sensor package substrate, the lower surface being located on a side of the solid-state imaging element. The present disclosure can be applied to, for example, the imaging device or the like.