Imaging Sensor Package Frame Layout for Heat Dissipation and Light Blocking
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Solution Overview
Problem
Conventional semiconductor packages with heat dissipation plates or sheets increase manufacturing costs and make it difficult to reduce package size due to the number of components required for effective heat dissipation.
Innovation Solution
A semiconductor package design featuring a solid-state imaging element with a partially extended frame that covers the circuit region and wires, using adhesives for bonding, which reduces the number of components needed for heat dissipation and light blocking, while also suppressing flares with a tapered end surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation plate or heat dissipation sheet is used to dissipate heat from the solid-state imaging element, then heat dissipation performance is improved, but the number of components increases, leading to increased manufacturing cost and difficulty in reducing package size
Solution Approach 1:
The patent merges the heat dissipation function with the frame structure by extending the inner wall of the frame inward to contact the circuit region. This integration eliminates the need for separate heat dissipation plates or sheets, thereby reducing component count while maintaining effective heat dissipation from both the pixel region and circuit region.
Solution Approach 2:
The frame is designed to perform multiple functions: it provides structural support, blocks unnecessary light, and dissipates heat through its extended inner wall portion. By making the frame multi-functional, the patent eliminates the need for additional dedicated heat dissipation components.
2Device complexity
If the number of components is reduced by integrating functions into the frame, then manufacturing cost decreases and package size can be reduced, but heat dissipation capability may be compromised
Solution Approach 1:
The frame integrates heat dissipation functionality by extending its inner wall to directly contact the circuit region, merging structural support and heat dissipation into a single component. This ensures heat dissipation capability is maintained without requiring additional heat dissipation components.
Solution Approach 2:
The frame's inner wall is selectively extended only in the region necessary to contact the circuit region, optimizing heat dissipation where needed while maintaining the overall simplicity of the structure. This localized modification ensures adequate heat dissipation without adding global complexity.
3Object-affected harmful factors
If the frame covers the circuit region and wires, then heat dissipation and light blocking are improved, but manufacturing precision requirements increase
Solution Approach 1:
The frame's inner wall is extended only to the necessary degree to contact the circuit region, providing localized heat dissipation and light blocking precisely where needed. This targeted approach reduces the overall precision requirements compared to a fully extended frame structure.
Solution Approach 2:
The extended portion of the frame acts as an intermediary structure that bridges the gap between the frame body and the circuit region, facilitating both heat dissipation and light blocking while accommodating manufacturing tolerances through its gradual extension.
4Object-affected harmful factors
If the extended portion of the frame has a tapered end surface, then flare suppression is improved, but manufacturing complexity increases
Solution Approach 1:
The extended portion of the frame features a tapered end surface with a gradual curvature rather than a sharp edge. This curved geometry suppresses light flare by preventing abrupt light reflections while remaining compatible with standard manufacturing processes for molded frames.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance, reduces manufacturing costs, and allows for a smaller package size by integrating heat dissipation and light blocking functions within the frame, thereby improving image quality and reducing component count.
Implementation Method 1
an adhesive for bonding the extended portion of the frame to the circuit region
Implementation Method 2
the frame may cover some of the wires and the circuit region. Therefore, it is possible to dissipate heat generated in the circuit region
Data Source
AI summary
The number of components of a semiconductor package is reduced. The semiconductor package includes a solid-state imaging element, a frame, and an adhesive. In the semiconductor package, the solid-state imaging element has a pixel region in which pixels are arrayed and a circuit region in which a predetermined circuit is arranged adjacent to the pixel region. In the semiconductor package, an inner wall of the frame surrounds an outer periphery of the solid-state imaging element, and a part of the inner wall is extended inward. In the semiconductor package, the adhesive bonds the extended portion of the frame and the circuit region.