Image Sensor Package Interposer for Gap Height and Light Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Image sensor packages face challenges in maintaining a controlled gap height without using excessive bonding material, which can lead to delamination and cracks, and in reducing lateral light incidence that degrades image quality.
Innovation Solution
The use of an interposer with defined cavity areas allows for precise control of the gap height between the image sensor die and the transparent member, reducing the need for additional bonding material and incorporating a second cavity area to minimize lateral light interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bonding material is used to couple the sensor device to the cover glass, then the gap height is defined, but excessive bonding material leads to delamination and cracks
Solution Approach 1:
An interposer is introduced as an intermediary component between the sensor die and the cover glass. The interposer includes a first cavity that receives the sensor die and a second cavity that defines the gap height, eliminating the need for excessive bonding material while maintaining reliable coupling and preventing delamination and cracks
Solution Approach 2:
The coupling structure is segmented into three distinct components: the sensor die, the interposer with its two cavities, and the cover glass. This segmentation allows the interposer to independently define the gap height through its second cavity while providing a stable mounting structure, thereby controlling gap height precision without requiring excessive bonding material
2Volume of moving object
If a larger gap height is used to accommodate larger image sensor devices, then more bonding material is needed, but this increases the risk of delamination and cracks
Solution Approach 1:
The interposer serves as a mediator that enables larger image sensor devices to be accommodated in compact packages. The first cavity receives the sensor die while the second cavity defines the gap height, allowing larger sensors to be integrated without increasing bonding material volume or delamination risk
Solution Approach 2:
The interposer utilizes vertical dimensionality with its two cavities arranged in the thickness direction. The first cavity accommodates the sensor die and the second cavity defines the gap height to the cover glass, enabling compact packaging of larger sensors by efficiently utilizing the vertical space without requiring excessive bonding material
3Manufacturing precision
If bonding material is used to define gap height, then gap control is achieved, but lateral light incidence degrades image quality
Solution Approach 1:
The interposer acts as an intermediary structure that defines the gap height through its second cavity while blocking lateral light paths. The interposer material prevents lateral light from reaching the sensor die, eliminating image quality degradation while maintaining precise gap control
Solution Approach 2:
The harmful function of the bonding material is extracted and replaced. Instead of using bonding material to define the gap (which allows lateral light incidence), the interposer's second cavity is designed to define the gap height while the interposer structure itself blocks lateral light, separating the gap-defining function from the light-blocking function
Data Source
AI summary
According to an aspect, an image sensor package includes a transparent member, a substrate, and an interposer disposed between and coupled to the transparent member and the substrate, where the interposer defines a first cavity area and a second cavity area. The image sensor package includes an image sensor die disposed within the first cavity area of the interposer, where the image sensor die has a sensor array configured to receive light through the transparent member and the second cavity area. The image sensor package includes a bonding material that couples the image sensor die to the interposer within the first cavity area.