Sensor Package Structure With IR-Cured Bonding and Glare Shielding

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Solution Overview

Problem

Conventional sensor package structures suffer from light reflection issues due to adhesives used, leading to glare and difficulty in controlling the levelness of glass boards, which affect sensor performance.

Innovation Solution

A sensor package structure incorporating an infrared light curing layer and a visible light shielding layer, where the shielding layer blocks visible light and allows only infrared light to pass through, ensuring precise solidification and levelness of the curing layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a conventional adhesive is used to bond the glass board to the sensor chip, then the sensor chip can be assembled, but light reflection occurs at the adhesive interface causing glare that affects the sensing region

Engineering Contradiction:

ImproveassemblyVSAvoidglare

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the adhesive layer from the bonding interface and replaces it with an infrared light curing layer that has different optical properties. This curing layer is designed to be transparent to infrared light (allowing curing) while blocking visible light (preventing glare), thus eliminating the harmful reflection effect while maintaining the bonding function.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the optical parameters of the bonding layer by using infrared light curing material instead of conventional adhesive. The material is formulated to have specific optical transmission characteristics: high transmission in the infrared wavelength range for curing and low transmission in the visible range to block glare, thereby resolving the contradiction between assembly need and glare prevention.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If conventional adhesive is used for bonding, then the glass board can be attached, but the levelness of the glass board becomes difficult to control due to adhesive solidification by heating

Engineering Contradiction:

ImproveattachmentVSAvoidlevelness control

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces the thermal solidification mechanism of conventional adhesive with an infrared light-cured polymerization process. The infrared light curing layer undergoes photo-polymerization when exposed to infrared light, allowing precise control of the curing process and resulting in a flat, level surface without the levelness control issues associated with heat-based solidification.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Object-affected harmful factors

If the visible light shielding layer is added to block visible light and reduce glare, then glare is reduced, but the structure becomes more complex

Engineering Contradiction:

Improveglare reductionVSAvoidstructure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The infrared light curing layer serves multiple functions simultaneously: it bonds the glass board to the sensor chip, enables precise levelness control through infrared-cured polymerization, and blocks visible light to prevent glare. By combining these functions into a single layer with specific optical properties, the patent avoids adding separate components and thus does not increase structural complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure effectively reduces glare and ensures precise control of the light-permeable layer's levelness by allowing infrared light to cure the curing layer, enhancing sensor performance.

Implementation Method 1

The visible light shielding layer is configured to block a visible light from passing therethrough

Methodology Applied

Scientific EffectLight blocking/absorption: Absorption (EM radiation)

Implementation Method 2

the visible light shielding layer only allows an infrared light to travel onto the infrared light curing layer by passing therethrough

Methodology Applied

Scientific EffectInfrared light transmission: Filter (optical)

Implementation Method 3

The infrared light curing layer is located in a projection space defined by orthogonally projecting the visible light shielding layer toward the substrate, and the visible light shielding layer only allows an infrared light to travel onto the infrared light curing layer by passing therethrough

Methodology Applied

Scientific EffectInfrared light curing: Photopolymerisation

Data Source

PatentUS20260068340A1Sensor package structure

Publication Date: 2026.03.05 TONG HSING ELECTRONICS IND LTD

AI summary

A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, an infrared light curing layer being in a ringed shape and disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the infrared light curing layer, and a visible light shielding layer that is in a ringed shape and that is disposed on the light-permeable layer. A sensing region of the sensor chip faces the light-permeable layer. The visible light shielding layer can block a visible light from passing therethrough, and has an opening located directly above the sensing region. The infrared light curing layer is located in a projection space defined by orthogonally projecting the visible light shielding layer toward the substrate, and the visible light shielding layer only allows an infrared light to travel onto the infrared light curing layer by passing therethrough.