Temperature Sensor Package With Dielectric Spacer for High-Voltage Isolation
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Solution Overview
Problem
Electronic temperature sensors in high voltage systems are prone to damage due to excessive electric fields, which degrade their performance.
Innovation Solution
A substrate with a dielectric layer, a die pad, and a semiconductor die is designed, where a dielectric spacer is mounted above the die pad, and the semiconductor die is thermally coupled to the dielectric spacer, providing electrical isolation and allowing the temperature sensor to operate safely amidst high voltage levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor die is placed directly on the die pad, then the device complexity is reduced, but the semiconductor die is exposed to excessive electric fields causing damage or degradation
Solution Approach 1:
A dielectric spacer is introduced as an intermediary component between the die pad and the semiconductor die. This spacer provides electrical isolation, preventing excessive electric fields from reaching the semiconductor die while maintaining thermal coupling for temperature sensing. The spacer resolves the contradiction by adding a protective intermediate layer without significantly increasing overall device complexity.
Solution Approach 2:
The solution moves from a planar two-dimensional arrangement to a three-dimensional structure by introducing vertical spacing through the dielectric spacer. This dimensional change allows the semiconductor die to be electrically isolated from the die pad while maintaining close proximity for thermal coupling, thus protecting the die from electric fields without requiring complex lateral routing.
2Reliability
If the semiconductor die is isolated from the die pad, then electric field stress is reduced, but thermal coupling efficiency decreases
Solution Approach 1:
The dielectric spacer exhibits different functional properties at different locations: it provides electrical isolation in the vertical direction between the die pad and semiconductor die, while maintaining thermal conduction pathways through its material composition. This local differentiation of properties allows simultaneous achievement of electric field isolation and thermal coupling.
Solution Approach 2:
The dielectric spacer is constructed from composite materials or layered structures that combine electrical insulation properties with thermal conduction capabilities. This composite approach enables the spacer to block excessive electric fields while still allowing efficient heat transfer from the die pad to the semiconductor die for accurate temperature sensing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively isolates the semiconductor die from high voltage electric fields, reducing stress volume and electric field leakage, thereby enhancing the reliability and accuracy of temperature sensing in high voltage environments.
Implementation Method 1
a dielectric spacer is mounted above the die pad in the opening, and the semiconductor die is mounted above the dielectric spacer
Implementation Method 2
The die pad is thermally coupled to the conductive PCB trace
Data Source
AI summary
An electronic device includes a substrate, a dielectric spacer, a semiconductor die, and a package structure. The substrate has a dielectric layer, a die pad, first and second leads, a conductive via, and a conductive trace, the dielectric layer has an opening extending into a side, the die pad is coupled to the first lead, the second lead is coupled to the conductive via, and the conductive trace is coupled to the via. The dielectric spacer is mounted above the die pad in the opening, and the semiconductor die is mounted above the dielectric spacer, the semiconductor die includes a temperature sensor, and an electrical connection couples the semiconductor die to the conductive trace. The package structure extends on the side of the dielectric layer, on the semiconductor die, and on the conductive trace, the package structure extending around the dielectric spacer and to the die pad in the opening.