Sensor Package With Substrate-Integrated Channels for Leak-Resistant Sealing

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Solution Overview

Problem

Existing sensor packages have complex fabrication processes and are prone to leaks due to adhesive failure, which complicates manufacturing and increases costs.

Innovation Solution

A sensor package design featuring a channel formed within a substrate, sealed by a lid, which includes cavities and openings for fluid access, allowing for robust sealing and easier manufacturing, with the option to measure pressure differentials or absolute pressures using a pressure sensor integrated on the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesive is used to seal the sensor package, then the package can be assembled, but the adhesive is prone to failure causing leaks

Engineering Contradiction:
Improveassembly processVSAvoidsealing integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent removes the adhesive sealing mechanism entirely and replaces it with a mechanical seal formed by integrating the channel directly into the substrate structure. The channel walls themselves form the seal, eliminating the intermediate adhesive layer that was prone to failure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The channel is integrated directly into the substrate, merging previously separate components (channel and substrate) into a unified structure. This integration eliminates the need for separate sealing operations and creates inherent structural seals at the interfaces.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If complex fabrication processes are used for sensor packages, then precise sealing can be achieved, but manufacturing complexity and costs increase

Engineering Contradiction:
Improvesealing integrityVSAvoidfabrication process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The channel fabrication is merged with the substrate manufacturing process, allowing both to be created simultaneously in a single fabrication sequence. This eliminates separate channel formation and sealing steps, reducing overall process complexity while maintaining seal integrity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The channel structure is preliminarily formed as part of the substrate during the substrate fabrication process itself, before the sensor assembly is complete. This preliminary integration of the channel into the substrate structure simplifies subsequent assembly steps.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If material is removed from the substrate to form a channel, then fluid flow is enabled, but structural strength may be reduced

Engineering Contradiction:
Improvefluid flow capabilityVSAvoidsubstrate structural integrity
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The channel is formed with optimized local geometry where material is strategically removed only where needed for fluid flow, while maintaining sufficient material in critical load-bearing regions. The channel walls are designed with appropriate thickness to balance flow capability and structural strength.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The substrate may utilize composite material structures or reinforced designs around the channel regions to compensate for material removal, maintaining overall structural integrity while enabling fluid flow pathways.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design provides a well-sealed package resistant to leaks, easier to manufacture, and capable of withstanding high pressures, with the ability to measure pressure differentials or absolute pressures, and can be applied to various sensors like pressure, flow, temperature, humidity, gas detection, and optical sensors.

Implementation Method 1

a sensor disposed on the substrate, the sensor being configured to sense a property relating to the fluid

Methodology Applied
Scientific EffectPressure sensing:

Implementation Method 2

the lid having at least one wall adhered to the substrate

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12422325B2Sensor package having a channel integrated within a substrate
Publication Date: 2025.09.23 ALL SENSORS CORP
  • US12422325B2 patent drawing
  • US12422325B2 patent drawing
  • US12422325B2 patent drawing

AI summary

A sensor package includes a substrate and a channel within the substrate. The channel is configured to allow flow of a fluid therethrough. The sensor package also includes a sensor disposed on the substrate and a lid. The sensor is configured to sense a property of the fluid. The lid forms at least one cavity between the lid and the substrate.