Multi-Chamber Sensor Package Layout for Chip Interference Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrating multiple sensors in a single package structure leads to miniaturization challenges and interference between chips, such as signal and thermal effects, reducing sensor sensitivity.
Innovation Solution
The sensor chip and processing chip are placed in separate chambers, with the processing chip isolated from the sensor chip by a spacer layer and filled with a gel, reducing interference and enhancing sensor sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple sensors are integrated into one package structure, then the package structure can be miniaturized, but the sensor sensitivity deteriorates due to interference between chips
Solution Approach 1:
The package structure is divided into multiple separate chambers, each housing different types of chips (sensor chips and processing chips). This segmentation physically isolates the sensor chips from processing chips, preventing signal and thermal interference while maintaining a compact overall package structure.
Solution Approach 2:
A gel substance is introduced as an intermediary material filling the space between different chip types within the same chamber. The gel acts as a buffer that reduces thermal and signal interference between chips while allowing them to coexist in a compact arrangement, thus maintaining miniaturization without sacrificing sensor sensitivity.
2Device complexity
If processing chips and sensor chips are placed in the same chamber, then the device complexity is reduced, but signal interference and thermal effects increase
Solution Approach 1:
The single chamber is segmented into multiple sub-chambers using spacer layers, creating separate enclosed spaces for different chip types. This segmentation allows processing chips and sensor chips to be placed in the same overall package while preventing direct interference between them through the physical barrier of the spacer layers.
Solution Approach 2:
The gel substance serves as a mediator between processing chips and sensor chips within the same chamber. It absorbs and dissipates thermal energy and reduces electromagnetic signal interference, allowing multiple chips to coexist in close proximity without generating harmful thermal and signal effects.
Data Source
AI summary
An electronic device includes a substrate, a package component, a spacer layer, a first sensor chip, first and second processing chips, and a gel. The substrate has upper and lower surfaces, a through hole, and a recess. The package component is disposed on the upper surface. The package component and the substrate define a first chamber. The spacer layer is disposed on the upper surface and covers the recess. The spacer layer and the recess define a second chamber. The first sensor chip is disposed on the upper surface, located in the first chamber, and covers the through hole. The first sensor chip is electrically connected to the first processing chip. The second processing chip is disposed in the recess and in the second chamber. The second processing chip is air isolated from the first chamber. The gel fills the second chamber and at least covers the second processing chip.