Sensor Package Interposer Reduces Wire Bond Length
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Solution Overview
Problem
MEMS-based sensors, such as inertial sensors, often fail under high stress conditions due to wire bond failures, which can lead to short circuits or joint breaks, reducing their functional range and requiring replacement.
Innovation Solution
The use of an interposer to reduce wire bond length by creating short wire bonds between the sensor, the interposer, and the external walls, enhancing resilience and allowing for retrofitting into existing package designs without redesigning the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonds are used to connect the sensor to external walls, then electrical connection is achieved, but wire bond length increases making them susceptible to breakage under high stress
Solution Approach 1:
An interposer is introduced as an intermediary component between the sensor and external walls. The interposer provides alternative connection paths that reduce wire bond length and stress, thereby improving reliability without compromising electrical connection functionality.
Solution Approach 2:
The single long wire bond connection is segmented into multiple shorter wire bonds by introducing the interposer. This segmentation reduces the length of each individual wire bond, making them less susceptible to breakage under high stress conditions.
2Reliability
If wire bonds are used to connect the sensor to external walls, then electrical connection is achieved, but wire bonds may short circuit or break under high stress conditions
Solution Approach 1:
The interposer is designed to absorb and distribute mechanical stress before it reaches the wire bonds. This beforehand cushioning effect protects the wire bonds from high stress conditions that would otherwise cause breakage or short circuits.
Solution Approach 2:
The interposer acts as a mediator that isolates the wire bonds from harmful high stress effects. By providing a stress-distributing intermediate structure, the interposer protects the electrical connections from mechanical damage.
3Adaptability or versatility
If existing sensor and package designs are used, then component compatibility is maintained, but wire bond length cannot be reduced without redesign
Solution Approach 1:
The interposer is designed as a universal component that can be integrated into existing sensor and package designs without requiring redesign of the sensor or package itself. This multi-functional approach allows the interposer to reduce wire bond length while maintaining compatibility with existing components.
Solution Approach 2:
The interposer serves as a retrofittable intermediary that bridges existing sensor and package designs. It provides the wire bond length reduction benefit without requiring changes to the original sensor or package architecture, enabling easy integration into existing systems.
Data Source
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Figure 2
Figure 3a~3b
AI summary
A sensor package (200) comprising: a sensor (202); at least one external wall (213); an interposer (206), arranged between the sensor (202) and the at least one external wall (213); wherein the sensor is wire bonded (208) to the interposer (206); and wherein the interposer (206) is wire bonded (208) to the at least one external wall (213). Using an interposer (206), wire bonded (208) to both the sensor (202) and the at least one external wall (213), is an improved approach to electrically connecting a sensor (202) and a sensor package (200). The interposer (206) allows for short wire bonds (208) from the sensor (202) and the at least one external wall (213) to the interposer (206), replacing the single, long wire bond from the sensor to the at least one external wall in the prior art. This provides improved resilience of the sensor package (200) under high stress. Furthermore, it allows an existing sensor and package combination to be improved without needing to redesign either component.