Sensor Package Light-Scattering Loop Wall Glare Reduction

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Solution Overview

Problem

Conventional sensor package structures experience glare due to light reflection from the glue layer above the sensor chip, affecting the sensing region.

Innovation Solution

A sensor package structure incorporating a substrate, a sensor chip, a ring-shaped solder mask forming a light-scattering loop wall, and a light permeable layer, where the light-scattering loop wall scatters light into multiple rays at different angles, reducing glare by forming an enclosed space with the sensor chip and light permeable layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a glue layer is used to surround the sensing region of the sensor chip, then the sensor chip can be properly packaged and protected, but light passing through the glass board is partially reflected by the glue layer causing glare phenomenon that affects the sensing region

Engineering Contradiction:
Improvepackaging protectionVSAvoidglare phenomenon
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a light-scattering loop wall as an intermediary structure between the glass board and the sensing region. This loop wall acts as a mediator that intercepts and scatters the reflected light before it reaches the sensing region, thereby eliminating the glare phenomenon while maintaining the packaging protection function of the glue layer

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent extracts the light-scattering function from the glue layer by introducing a separate light-scattering loop wall structure. This separates the packaging protection function (performed by the glue layer) from the light management function (performed by the loop wall), allowing each component to optimize its specific function without interfering with the other

Inventive Principle:
Principle #2Taking out (Extraction)

2Object-affected harmful factors

If a light-scattering loop wall is introduced to reduce glare, then the glare phenomenon is effectively reduced, but the device structure becomes more complex

Engineering Contradiction:
Improveglare phenomenonVSAvoidpackage structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The light-scattering loop wall is designed to serve multiple functions simultaneously: it acts as a structural support element, a light-scattering component, and a defining element for the enclosed space. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving glare reduction

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the light-scattering function with the existing structural framework of the sensor package. The loop wall is integrated into the overall package structure rather than being a separate add-on component, combining structural and optical functions in a single element to minimize structural complexity

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively reduces the glare phenomenon by scattering light into multiple rays at angles different from the incident angle, improving the performance of the sensor package structure.

Implementation Method 1

When light passes through the light permeable layer and then impinges onto the light-scattering loop wall at an incident angle, the light-scattering loop wall scatters the light into multiple rays at angles different from the incident angle

Methodology Applied
Scientific EffectLight scattering: Scattering

Data Source

PatentUS11257964B2Sensor package structure
Publication Date: 2022.02.22 TONG HSING ELECTRONICS IND LTD
  • US11257964B2 patent drawing
  • US11257964B2 patent drawing
  • US11257964B2 patent drawing

AI summary

A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, an opaque support (e.g., a ring-shaped solder mask) disposed on the sensor chip, and a light permeable layer disposed on the opaque support. The sensor chip includes a sensing region. The opaque support surrounds the sensing region, and inner lateral sides of the opaque support form a light-scattering loop wall. The light permeable layer, the light-scattering loop wall of the opaque support, and the sensor chip jointly define an enclosed space therein. When light passes through the light permeable layer and impinges onto the light-scattering loop wall at an incident angle, the light-scattering loop wall scatters the light into multiple rays at angles different from the incident angle.