Sensor Package Light Shielding Notch Design
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Solution Overview
Problem
Conventional sensor package structures experience glare issues due to external light being reflected by the supporting layer, which affects the sensing results of the sensor chip.
Innovation Solution
A sensor package structure is designed with a substrate, sensor chip, ring-shaped support, light permeable board, and opaque package body, where the light permeable board and ring-shaped support form an enclosed space, and a ring-shaped notch with a light shielding portion is used to mitigate light reflection, improving image sensing quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a light permeable board is used to allow external light to reach the sensor chip, then the sensor chip can receive external light signals, but some external light is reflected by the supporting layer causing flare phenomenon that affects sensing results
Solution Approach 1:
A light shielding layer is introduced as an intermediary component between the light permeable board and the supporting layer. This light shielding layer selectively blocks reflected light while allowing transmitted light to reach the sensor chip, thereby resolving the contradiction between receiving external light signals and preventing harmful light reflection
Solution Approach 2:
The supporting layer is segmented into multiple layers including a light shielding layer and a supporting layer. This segmentation allows the light shielding layer to specifically address the light reflection problem while the supporting layer maintains its structural support function, thus resolving the contradiction between light reception and flare prevention
2Object-affected harmful factors
If a light shielding layer is added to block reflected light, then light reflection and flare are reduced, but the device structure becomes more complex
Solution Approach 1:
The light shielding layer is merged with the supporting layer to form an integrated light shielding and supporting structure. This merging reduces the number of separate components and simplifies the overall package structure while still achieving the light reflection reduction goal
Solution Approach 2:
The supporting layer is designed to serve multiple functions: providing structural support and simultaneously acting as a light shielding layer to block reflected light. This multi-functionality reduces the need for additional dedicated light shielding components, thereby simplifying the device structure while maintaining effective flare prevention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces light reflection, enhancing the image sensing quality of the sensor chip by minimizing external light signal reflection from the ring-shaped support after passing through the light permeable board.
Implementation Method 1
The light permeable board has a first surface, a second surface opposite to the first surface, and an outer lateral side. The second surface of the light permeable board is disposed on the ring-shaped support.
Implementation Method 2
some of the external light passing through the light permeable board is reflected by the supporting layer and induces a flare phenomenon
Implementation Method 3
The opaque package body connects with the outer lateral side of the light permeable board and the ring-shaped support, and a part of the opaque package body is filled into the ring-shaped notch and is defined as a light shielding portion
Data Source
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AI summary
A sensor package structure includes a substrate (1), a sensor chip (2) on the substrate (1), a ring-shaped support (4), a light permeable board (5) on the ring-shaped support (4), and an opaque package body (6) formed on the substrate (1). A top surface (21) of the sensor chip (2) includes a spacing region (212) and a carrying region (213) surrounding the spacing region (212). The support (4) is disposed on the carrying region (213). The light permeable board (5) has a ring-shaped notch (53) recessed from an upper surface thereof, and the notch (53) includes a platform surface (531) at least partially located above the support (4) and a wall surface (532) connected to the platform surface (531) and located above the spacing region (212). A portion of the opaque package body (6) fills the notch (53) and is defined as a light shielding portion (63). An inner lateral side (42) of the support (4) is arranged in a projection area formed by orthogonally projecting the platform surface (531) onto the top surface (21).