Sensor Package Metal Wire Embedding for Miniaturization

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Solution Overview

Problem

Conventional sensor package structures are not suitable for miniaturization and face challenges in forming metal wires without failures, making it difficult to establish reliable electrical connections between sensor chips and substrates.

Innovation Solution

A sensor package structure that includes a substrate, sensor chip, chip-bonding adhesive, metal wires, combining layer, and light-permeable layer, where the metal wires have specific dimensions and angles to ensure proper embedding in the combining and packaging compounds, avoiding failures and enabling efficient packaging of smaller sensor chips.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional sensor package structure is used, then packaging of larger sensor chips is achieved, but miniaturization becomes difficult

Engineering Contradiction:

Improvesensor chip sizeVSAvoidpackaging suitability

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent changes the geometric parameters of metal wires (diameter: 0.8-1.1 mil, sloping angle: 5-45 degrees) and spacing (welding pad distance: 210-660 μm) to enable successful packaging of smaller sensor chips. These parameter adjustments allow the wires to be properly embedded in the combining layer and packaging compound while maintaining electrical connections, thus resolving the contradiction between miniaturization and manufacturing ease.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If metal wires are formed in conventional sensor package structure, then electrical connection is established, but wire formation failures occur

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmetal wire formation quality

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent specifies precise parameters for metal wires including diameter (0.8-1.1 mil), sloping angle (5-45 degrees relative to sensor chip top surface), and welding pad spacing (210-660 μm from chip lateral side). These controlled parameters ensure wires can be formed without failures while establishing reliable electrical connections between the sensor chip and substrate.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent requires the second segment of metal wires to integrally and curvedly extend from the first segment, forming a smooth curve rather than sharp angles. This curved configuration reduces stress concentration and prevents wire formation failures, improving both manufacturing precision and connection reliability.

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Area of stationary object

If sensor chip size is reduced, then more components can be disposed, but conventional packaging structure becomes unsuitable

Engineering Contradiction:

Improvedevice component densityVSAvoidpackaging structure compatibility

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent adjusts multiple parameters simultaneously: metal wire diameter (0.8-1.1 mil), wire sloping angle (5-45 degrees), welding pad spacing (210-660 μm), and embedding depth in combining layer. These coordinated parameter changes enable the packaging structure to accommodate smaller sensor chips while maintaining ease of manufacture and reliable electrical connections.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed structure effectively packages smaller sensor chips by embedding metal wires in the combining and packaging compounds, ensuring reliable electrical connections and overcoming the challenges of metal wire formation and miniaturization.

Implementation Method 1

The bottom surface of the sensor chip is entirely adhered to the upper surface of the substrate through the chip-bonding adhesive

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

One ends of the metal wires are respectively connected to the welding pads, and the other ends of the metal wires are respectively connected to the connecting pads

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

The packaging compound is disposed on the upper surface of the substrate and covers the lateral side of the sensor chip, a lateral side of the combining layer, and a lateral side and the fixing region of the light-permeable layer

Methodology Applied

Scientific EffectEncapsulation: Physical Containment

Data Source

PatentUS10692917B2Sensor package structure

Publication Date: 2020.06.23 TONG HSING ELECTRONICS IND LTD

AI summary

A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the sensor chip to the substrate, a light-permeable layer, a combining layer connecting a portion of the light-permeable layer onto the sensor chip, and a packaging compound covering lateral sides of the sensor chip, the light-permeable layer, and the combining layer. Each of the metal wires is embedded in the combining layer and the packaging compound, and has a diameter within a range of 0.8-1.1 mil. Each of the metal wires includes a first segment connected to the substrate and a second segment connected to the sensor chip. In each of the metal wires, the second segment integrally and curvedly extends from the first segment, and the second segment and a top surface of the sensor chip have a sloping angle within a range of 5-45 degrees.