Redistribution-Layer Sensor Package for Compact mmWave Antennas

Solution Overview

Problem

The large size and high production cost of antenna transceivers in system-in-package (SIP) assemblies for millimeter wave wireless communication, WiFi, and telecommunication pose significant challenges.

Innovation Solution

The formation of a sensor package with a redistribution layer structure that includes an antenna transmitter structure and an antenna receiver structure, which are integrated alongside a semiconductor chip, allowing for a compact design and reduced production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a traditional antenna transceiver is used in SIP assembly, then electromagnetic wave transmission and reception capabilities are achieved, but the package size becomes large and production cost increases

Engineering Contradiction:

Improveelectromagnetic wave transmission and reception capabilitiesVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines the antenna transmitter structure and antenna receiver structure with the semiconductor chip into a single integrated package. The antenna transmitter is formed over a first region of the semiconductor chip, the antenna receiver is formed over a second region, and a redistribution layer electrically connects both antennas to the chip, merging multiple functions into one compact unit rather than using separate traditional antenna transceiver components

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The semiconductor chip serves multiple functions simultaneously: it acts as the core processing unit, hosts the antenna transmitter structure for signal transmission, hosts the antenna receiver structure for signal reception, and provides the substrate for the redistribution layer that enables electrical connections. This multi-functional integration eliminates the need for separate antenna transceiver components

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If a traditional antenna transceiver is used in SIP assembly, then electromagnetic wave transmission and reception capabilities are achieved, but production cost increases

Engineering Contradiction:

Improveelectromagnetic wave transmission and reception capabilitiesVSAvoidproduction cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the antenna transmitter structure and antenna receiver structure with the semiconductor chip into a single integrated package. The antenna transmitter is formed over a first region of the semiconductor chip, the antenna receiver is formed over a second region, and a redistribution layer electrically connects both antennas to the chip, merging multiple functions into one compact unit rather than using separate traditional antenna transceiver components

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent divides the antenna system into distinct segments: an antenna transmitter structure over a first region, an antenna receiver structure over a second region, and a redistribution layer for electrical connections. This segmentation allows each component to be optimized and manufactured independently using standard semiconductor fabrication processes, reducing overall production cost compared to integrating a complete traditional antenna transceiver

Inventive Principle:

Principle #1Segmentation

3Area of stationary object

If antenna transmitter and receiver structures are integrated with semiconductor chip, then package size is reduced, but manufacturing complexity increases

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent divides the antenna system into distinct segments: an antenna transmitter structure over a first region, an antenna receiver structure over a second region, and a redistribution layer for electrical connections. This segmentation allows each component to be optimized and manufactured independently using standard semiconductor fabrication processes, reducing overall production cost compared to integrating a complete traditional antenna transceiver

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent utilizes the vertical dimension by forming the antenna transmitter and receiver structures at different regions and layers on the semiconductor chip surface. The redistribution layer is positioned to electrically connect these structures to the chip, effectively using three-dimensional space to accommodate multiple functions without increasing the planar footprint, thus reducing package size while managing manufacturing complexity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12266847B2Semiconductor packages and manufacturing methods thereof

Publication Date: 2025.04.01 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.