Sensor Package Structure Miniaturization via Pad Extraction
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Solution Overview
Problem
Conventional sensor package structures are not suitable for packaging smaller-sized sensor chips, making miniaturization difficult due to limitations in accommodating smaller components within electronic devices.
Innovation Solution
A sensor package structure design that includes a substrate, a sensor chip with specific edge configurations, metal wires, a translucent layer, and an adhesive compound, allowing for the packaging of smaller sensor chips without connecting pads, and embedding metal wires within the adhesive compound to maintain reliability and prevent contact with the translucent layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional sensor package structure is used, then wire bond clearance is provided, but sensor chip size cannot be reduced
Solution Approach 1:
The patent removes the connecting pad from the sensor chip, extracting the function of electrical connection to be performed elsewhere (on the substrate). This eliminates the need for wire bonds to clear over the chip edges, enabling chip miniaturization while maintaining wire bond clearance requirements.
Solution Approach 2:
The substrate serves as an intermediary, providing both the mounting surface for the sensor chip and the location for welding pads. This allows electrical connections to be established on the substrate rather than requiring wire bonds to clear the chip perimeter, resolving the contradiction between chip size reduction and wire bond clearance.
2Volume of moving object
If sensor chip size is reduced, then more components can be accommodated, but conventional package structure becomes unsuitable
Solution Approach 1:
The substrate performs multiple functions: it provides mechanical support, electrical connections through welding pads, and mounting surface for the sensor chip. This multi-functional design creates a universal package structure that can accommodate various sensor chip sizes, including miniaturized chips, while maintaining manufacturing feasibility.
Solution Approach 2:
The patent segments the electrical connection function from the sensor chip itself (by removing connecting pads) and relocates it to the substrate (with welding pads). This segmentation allows the chip to be minimized while the substrate handles all connection requirements, making the package structure suitable for smaller chips.
3Length of moving object
If connecting pads are removed from sensor chip, then chip size is reduced, but electrical connection must be reconfigured
Solution Approach 1:
The patent merges the electrical connection function with the substrate by providing welding pads on the substrate surface. This combines the mounting function and electrical connection function into a single integrated structure, simplifying the overall device while enabling chip size reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the effective packaging of smaller sensor chips by providing sufficient space and protection, enhancing the reliability of the sensor package structure and reducing the size of the package, thus accommodating more components in electronic devices.
Implementation Method 1
an adhesive compound disposed on the substrate and covering a portion of the sensor chip and the metal wires
Data Source
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AI summary
A sensor package structure (100) includes a substrate (1), a sensor chip (2) disposed on the substrate (1), several metal wires (3) electrically connected to the substrate (1) and the sensor chip (2), a translucent layer (4) corresponding in position to the sensor chip (2), and an adhesive (5). A top surface (21) of the sensor chip (2) has a sensing region (211) and a spacing region (212) around the sensing region (211). The sensor chip (2) includes several connecting pads (215) arranged on a first portion of the top surface (21) between the first edge (213) and the spacing region (212), and a second portion of the top surface (21) between the second edge (214) and the spacing region (212) is provided without any connecting pad. The width of the first portion is greater than that of the second portion. The adhesive (5) covers the surrounding side (23) of the sensor chip (2), the first portion, and the surrounding side (43) of the translucent layer (4). Part of each metal wire (3) is embedded in the adhesive (5).