Sensor Package Structure Using Pressure-Sensitive Adhesive
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Solution Overview
Problem
Conventional compact camera module (CCM) production processes, such as CSP and COB, face issues with adhesive solidification time, non-uniform pressing, and particle pollution, leading to inefficiencies and increased costs.
Innovation Solution
A sensor package structure utilizing a sensing die, a light-filtering sheet, and a solid pressure-sensitive adhesive sheet with constant thickness and shape, where the adhesive sheet seamlessly adheres to both the die and the light-filtering sheet, ensuring parallel alignment and sealing the sensing region, and a production apparatus that facilitates efficient assembly with a shifting member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the CSP process is used to fix the die to the glass via adhesive, then the die can be securely fixed, but the adhesive needs a lot of time to solidify by baking, reducing the capacity of the package structure
Solution Approach 1:
The patent changes the adhesive from a traditional bonding adhesive requiring thermal curing to a pressure-sensitive adhesive that cures through pressure application. This parameter change in the adhesive type eliminates the need for baking time, allowing immediate fixation while maintaining reliable die attachment to the glass substrate.
Solution Approach 2:
The patent replaces the thermal curing mechanism with a mechanical pressure-based curing mechanism. Instead of using heat to solidify the adhesive, the system uses pressure-sensitive adhesive that sets when pressure is applied during assembly, thereby eliminating the time-consuming baking process while ensuring reliable fixation.
2Ease of manufacture
If the dripping machine is used to combine glass and die by pressing, then the glass and die can be assembled, but the adhesive flows radially and cannot be controlled, causing glass tilt and non-parallelism
Solution Approach 1:
The patent uses a pressure-sensitive adhesive sheet with controlled thickness and properties that prevents uncontrolled radial flow. The adhesive is applied in a controlled manner and sets quickly under pressure, maintaining the glass and die in a parallel relationship without tilting, thus ensuring manufacturing precision while keeping the assembly process simple.
3Ease of manufacture
If the COB process is used to directly combine die to circuit board, then the assembly is simple, but the die has particle pollution problem when installing to other components
Solution Approach 1:
The patent introduces a pressure-sensitive adhesive sheet as an intermediary layer between the die and the glass substrate. This intermediary prevents direct contact between the die surface and the assembly environment, thereby preventing particle pollution on the die while still allowing simple assembly. The adhesive sheet acts as a protective barrier that maintains cleanliness during the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production time, increases yield and capacity, and minimizes particle pollution, allowing for a smaller clean room and lower costs.
Implementation Method 1
an annular pressure-sensitive adhesive sheet having two opposite adhesive surfaces and defining an opening, wherein the adhesive surfaces of the pressure-sensitive adhesive sheet are respectively pressed to seamlessly adhere to the connecting region of the sensing die and the inner surface of the light-filtering sheet
Data Source
AI summary
A sensor package structure includes a sensing die, a light-filtering sheet, and an annular pressure-sensitive adhesive sheet. An active surface of the sensing die has a sensing region and a connecting region around the sensing region. The periphery contour of sensing die is greater than or equal to the periphery contour of light-filtering sheet. The pressure-sensitive adhesive sheet has two opposite adhesive surfaces and defines an opening. The adhesive surfaces respectively adhere to the connecting region of the sensing die and the inner surface of the light-filtering sheet, and the sensing region faces the inner surface of the light-filtering sheet via the opening. The sensing region is sealed by the pressure-sensitive adhesive sheet and the light-filtering sheet. Thus, the instant disclosure provides the sensor package structure with low cost, high capacity, and high yield. Moreover, the instant disclosure provides a production apparatus for manufacturing the sensor package structure.