Chip-Scale Sensor Package with RDL and Ring Support
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Solution Overview
Problem
Conventional chip-scale sensor package structures experience delamination issues between the light permeable member and the glue layer during temperature cycle tests, leading to structural failures.
Innovation Solution
A chip-scale sensor package structure is designed with a ring-shaped support, a light permeable member, a package body, and a redistribution layer (RDL), where the RDL is directly formed on the bottom surface of the sensor chip and package body, enhancing bonding strength by covering the outer lateral sides of the light permeable member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light permeable member is mounted simply through adhering with a glue layer, then the manufacturing process is simple and easy, but delamination occurs during temperature cycle tests
Solution Approach 1:
The patent divides the mounting structure into multiple segments: the light permeable member, the ring-shaped support structure, and the package body are separated into distinct components that work together. This segmentation allows each component to perform its specific function while maintaining overall structural integrity and preventing delamination.
Solution Approach 2:
The patent implements a nested structure where the light permeable member is positioned within a cavity formed by the ring-shaped support, which is in turn surrounded by the package body. This nested arrangement provides multiple layers of structural support and constraint, enhancing bonding strength while preventing delamination during temperature cycling.
2Productivity
If the area size of the light permeable member is substantially equal to that of the package structure, then the chip-scale integration is achieved, but delamination defects occur under thermal stress
Solution Approach 1:
The patent applies local quality by creating a ring-shaped support structure that provides localized reinforcement around the light permeable member. This ring structure concentrates structural support at critical locations where thermal stress causes delamination, while maintaining the overall chip-scale area constraints.
Solution Approach 2:
The patent employs a composite structure combining the light permeable member, the ring-shaped support (made of different material properties), and the package body. This composite approach allows each material to contribute its specific properties, creating a structurally integrated assembly that maintains chip-scale dimensions while resisting thermal stress-induced delamination.
Data Source
AI summary
A chip-scale sensor package structure includes a sensor chip, a ring-shaped support disposed on a top surface of the sensor chip, a light permeable member disposed on the ring-shaped support, a package body, and a redistribution layer (RDL). The package body surrounds outer lateral sides of the sensor chip, the ring-shaped support and the light permeable member. A bottom surface of the sensor chip and a surface of the light permeable member are exposed from the package body. The RDL is directly formed on the bottom surface of the sensor chip and a bottom side of the package body. The RDL includes a plurality of external contacts arranged on a bottom surface thereof and electrically coupled to the sensor chip. A portion of the external contacts are arranged outside of a projection region defined by orthogonally projecting the sensor chip onto the bottom surface of the RDL.