Sensor Package Retention via Peripheral Clips
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Solution Overview
Problem
Current magnetoresistance sensors integrated into integrated circuits face challenges in miniaturization and integration, leading to increased system costs and potential errors in assembly due to the need for retaining components over the sensor sensing face, which also results in a larger airgap between the sensor and the target, affecting accuracy and efficiency.
Innovation Solution
A sensor package assembly with retention features that allows full exposure of the sensing face within a carrier, utilizing retaining clips and notches to securely position the sensor package closer to the target, reducing assembly errors and system costs by eliminating unnecessary retaining components and minimizing the airgap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If retaining components are used over the sensor sensing face, then the sensor package is securely retained, but the sensing face is blocked and airgap increases
Solution Approach 1:
The retention mechanism is segmented into separate locations away from the sensing face. The carrier has retaining walls that engage with the sensor package housing at locations peripheral to the sensing face, allowing retention without blocking the sensing area.
Solution Approach 2:
The retaining components are extracted from the sensing face area and relocated to the periphery of the sensor package. The retention features are positioned on the housing away from the sensing face, eliminating the conflict between retention and sensing.
2Reliability
If retaining components are placed over the sensing face, then the sensor package is held in position, but assembly errors increase and system costs increase
Solution Approach 1:
The retention features are merged into the carrier structure itself rather than being separate components. The retaining walls are integrated into the carrier body, eliminating additional retaining components and simplifying the overall assembly.
Solution Approach 2:
The carrier serves multiple functions: it provides mechanical support, electrical connections, and retention of the sensor package. The retaining walls are part of the carrier structure, making the carrier a multi-functional component that reduces overall system complexity.
3Measurement precision
If the sensor package is positioned closer to the target, then measurement accuracy improves, but retention becomes more difficult
Solution Approach 1:
The retention mechanism operates in a different spatial dimension than the sensing function. The retaining walls engage with the housing in a plane away from the sensing face, allowing the sensing face to be positioned close to the target while retention is maintained through a different spatial path.
Data Source
AI summary
Embodiments relate generally to systems and methods for retaining a sensor package within a carrier. A sensor package assembly may comprise a sensor package comprising at least one sensor element located within a sensing face of the sensor package; and a carrier comprising retention features configured to retain the sensor package while completely exposing the sensing face of the sensor package. A method for retaining a sensor package within a carrier may comprise inserting a sensor package into a carrier, wherein inserting the sensor package displaces one or more retaining clips of the carrier; retaining the sensor package within the carrier via the retaining clips interfacing with one or more notches of the sensor package; and exposing a sensing face of the sensor package via an opening in the carrier, wherein the sensor package comprises one or more sensor elements located in the sensing face of the sensor package.