Sensor Package Structure With Ring Support for Sensing Region Protection
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Solution Overview
Problem
Conventional sensor package structures face contamination issues due to the proximity of the sensing region to the lateral sides of the sensor chip during manufacturing, leading to reduced production yield and potential product failure.
Innovation Solution
A sensor package structure incorporating a ring-shaped solder mask frame that surrounds the outer lateral side of the sensor chip, with precise control over its thickness and shape to prevent contamination, along with a light permeable member and ring-shaped support, creating an enclosed space to protect the sensing region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the sensing region is placed closer to the lateral sides of the sensor chip to maximize sensing area, then the sensing coverage is improved, but the sensing region becomes more susceptible to contamination from melted or fluid package body during manufacturing
Solution Approach 1:
A ring-shaped support structure is introduced as an intermediary component between the package body and the sensor chip. This ring-shaped support creates a physical barrier that prevents the melted or fluid package body from directly contacting the sensing region, while still allowing the sensing region to be positioned close to the lateral sides for maximum sensing coverage
Solution Approach 2:
The ring-shaped solder mask frame and ring-shaped support are pre-configured around the sensor chip before the package body is molded. This preliminary protective structure prevents contamination from occurring during the molding process, allowing the sensing region to be positioned optimally without risk of exposure to harmful molten material
2Area of moving object
If the sensing region is placed closer to the lateral sides of the sensor chip, then the sensing coverage is improved, but the production yield decreases due to contamination risks
Solution Approach 1:
The ring-shaped support acts as a protective intermediary that enables manufacturers to position the sensing region close to the lateral sides without fearing contamination. This resolves the yield issue by providing a reliable protective barrier, allowing optimal sensing region placement while maintaining high production yield
Solution Approach 2:
The protective ring structures are formed in advance during the packaging process, creating a safeguard before the contamination risk occurs during molding. This preliminary protective action ensures that even with aggressive sensing region placement, the production process remains reliable and yield remains high
3Object-affected harmful factors
If a protective structure is added around the sensor chip to prevent contamination, then the sensing region protection is improved, but the device complexity increases
Solution Approach 1:
The ring-shaped support and ring-shaped solder mask frame utilize thin-film and shell-like structures that provide effective protection while adding minimal complexity. These thin-film protective elements conform to the sensor chip geometry and integrate seamlessly into the existing package structure, avoiding significant complexity increases
Solution Approach 2:
The protective structure is segmented into discrete functional elements (ring-shaped solder mask frame, ring-shaped support, light permeable member) that can be independently manufactured and then assembled. This segmentation allows each component to be optimized separately and simplifies the overall manufacturing process, reducing the impact of added protection on device complexity
Data Source
AI summary
A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.