Sensor Package Structure With Rounded Corners for Void-Free Encapsulation
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Solution Overview
Problem
Conventional sensor package structures suffer from gaps that cannot be fully filled by encapsulants, leading to voids or bubbles due to right-angle corners, which cause stress on the supporting structures.
Innovation Solution
A sensor package structure with a ring-shaped supporting layer and a light-permeable layer featuring rounded corners, where the second inward distance between the rounded corners and arc-shaped segments is within 95% to 105% of the first inward distance, allowing the encapsulant to fully fill gaps and prevent bubbles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the glass and sensor chip are connected with a long gap and right-angle corners, then the adhesive layer can be positioned, but the encapsulant cannot fill the gap completely, causing voids or bubbles
Solution Approach 1:
The patent applies curvature by replacing the conventional right-angle corners with arc-shaped segments. The supporting layer and light-permeable layer both feature arc-shaped corners that enable the encapsulant to flow into and completely fill the gaps, eliminating voids and bubbles while maintaining structural integrity.
2Device complexity
If the gap is long and has right-angle corners, then the supporting structure is simple, but stress concentrates on the supporting layer causing potential failure
Solution Approach 1:
The arc-shaped segments at the corners of the supporting layer distribute stress more evenly compared to sharp right angles. This curvature design reduces stress concentration points, enhancing the stress resistance of the supporting layer without significantly increasing structural complexity.
Solution Approach 2:
The patent modifies the geometric parameters of the supporting layer by introducing arc-shaped segments with specific radii. This parameter change transforms the corner geometry from sharp angles to curved transitions, fundamentally altering the stress distribution characteristics and improving overall strength.
Data Source
AI summary
A sensor package structure and a sensing module thereof are provided. The sensing module includes a sensor chip, a light-permeable layer, and a ring-shaped supporting layer that is sandwiched between the sensor chip and the light-permeable layer. The ring-shaped supporting layer includes a plurality of strip segments and a plurality of arc-shaped segments that are connected to the strip segments. The inner surface of the light-permeable layer includes a plurality of straight edges and a plurality of rounded corners. The straight edges are respectively arranged adjacent to the strip segments, and are each spaced apart from the adjacent strip segment by a first inward distance. The rounded corners are respectively arranged adjacent to the arc-shaped segments, and are each spaced apart from the adjacent arc-shaped segment by a second inward distance that is within a range from 95% to 105% of the first inward distance.