Sensor Package Structure Mitigating Adhesive Flare via Shielding Layer
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Solution Overview
Problem
Conventional sensor package structures experience flare phenomena due to light reflection from adhesives, affecting the sensing region of sensor chips.
Innovation Solution
A sensor package structure incorporating a substrate, sensor chip, light-curing layer, light-permeable layer, and shielding layer, where the shielding layer is positioned to mitigate light reflection and ensure adequate curing light exposure for the light-curing layer, thereby reducing flare effects and complete solidification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass board is disposed above a sensor chip through an adhesive, then the sensor package structure is formed, but light passing through the glass board is partially reflected by the adhesive causing flare phenomenon in the sensing region
Solution Approach 1:
A light-curing layer is introduced as an intermediary substance between the glass board and the sensor chip. This layer serves as a mediator that prevents direct contact between the adhesive and the sensing region, thereby eliminating the adhesive's harmful light reflection effect while maintaining the structural bonding function.
Solution Approach 2:
The adhesive layer is segmented or replaced by introducing the light-curing layer in between. The adhesive is applied only on specific regions (carrying region) rather than covering the entire sensor chip surface, particularly avoiding the sensing region. This segmentation prevents the adhesive from causing flare phenomenon in the sensing area.
2Object-affected harmful factors
If a shielding layer is added to reduce light reflection, then flare phenomenon is reduced, but the light-curing layer may not receive sufficient curing light exposure
Solution Approach 1:
The shielding layer is applied with local quality variation - it is disposed on specific regions (carrying region) of the sensor chip rather than uniformly covering the entire surface. This localized application ensures that the shielding effect is provided where needed (near the sensing region) while leaving other areas open to receive sufficient curing light exposure.
Solution Approach 2:
The shielding layer provides partial shielding action rather than complete coverage. By positioning the shielding layer at specific distances from the sensing region and using appropriate thickness, it provides sufficient light reflection prevention while allowing excessive or adequate light exposure to reach the light-curing layer for complete curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively minimizes flare phenomena and ensures complete solidification of the light-curing layer, enhancing the precision and reliability of the sensor package structure.
Implementation Method 1
The light-curing layer has an annular shape and is disposed on the carrying region... a portion of the light-curing layer under the shielding layer can be irradiated by enough curing-light so that the light-curing layer is entirely solidified
Data Source
AI summary
A sensor package structure and a sensing module thereof are provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the light-curing layer, and a shielding layer disposed on a surface of the light-permeable layer. The light-curing layer has an inner lateral side and an outer lateral side opposite to the inner lateral side, and the inner lateral side is separated from the outer lateral side by a first distance. In a transverse direction parallel to a top surface of the sensor chip, the outer lateral side is separated from an outer lateral edge by a second distance which is within a range of ½ to ⅓ of the first distance.