Sensor Package Shielding Layout for Flare and Delamination
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Solution Overview
Problem
Conventional sensor package structures face issues with light reflection causing flare phenomena and delamination between shielding and adhesive layers, affecting the sensing region and production yield.
Innovation Solution
A sensor package structure comprising a substrate, sensor chip, light-curing layer, light-permeable layer, and shielding layer, where the shielding layer is positioned to block visible light without overlapping critical areas, preventing delamination and allowing infrared light to pass through, thus reducing flare effects and maintaining the curing process integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding layer is embedded in the adhesive between the glass board and sensor chip, then the flare phenomenon is reduced, but delamination occurs in the shielding layer
Solution Approach 1:
The shielding layer is extracted from the adhesive and repositioned on the inner surface of the light-permeable layer. This separation eliminates the delamination problem that occurred when the shielding layer was embedded in the adhesive, while still maintaining the light-blocking function to reduce flare phenomenon.
Solution Approach 2:
The light-permeable layer serves as an intermediary carrier for the shielding layer. By placing the shielding layer on the light-permeable layer instead of embedding it in the adhesive, the structure provides a stable mounting surface that prevents delamination while allowing the shielding layer to fulfill its light-blocking function.
2Object-affected harmful factors
If a shielding layer is added to block light, then the flare phenomenon is reduced, but the curing process of the light-curing layer is affected
Solution Approach 1:
The light-blocking function is segmented into a separate shielding layer component rather than being integrated into the adhesive or light-curing layer. This allows the shielding layer to be positioned after the curing process, eliminating interference with UV light transmission during curing while still providing light blocking for visible light that causes flare.
Solution Approach 2:
The light-curing layer is cured first using UV light before the shielding layer is added. This preliminary curing action ensures that the adhesive is already set and will not be interfered with by the subsequent addition of the shielding layer, while the shielding layer can then be positioned to block visible light without affecting the already-cured structure.
3Object-affected harmful factors
If the shielding layer covers the assembling region, then light blocking is improved, but delamination occurs between the shielding layer and light-permeable layer
Solution Approach 1:
The shielding layer is designed with local quality by positioning it specifically in regions where light blocking is needed while avoiding the assembling region. This selective positioning provides effective flare reduction in the sensing area while preventing delamination by not covering the assembling region where bonding occurs.
Solution Approach 2:
Instead of covering the entire light-permeable layer, the shielding layer is applied partially only where needed for light blocking. This partial action provides sufficient flare reduction while avoiding the harmful effect of covering the assembling region, which would cause delamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces flare phenomena, prevents delamination, and increases production yield by blocking visible light while allowing infrared light to pass through, enabling accurate detection and maintaining the curing process integrity.
Implementation Method 1
a light-curing layer, and a light-permeable layer, where the inner surface has an assembling region being ring-shaped. The assembling region of the light-permeable layer is disposed on the light-curing layer
Implementation Method 2
The shielding layer is ring-shaped and is disposed on the light-permeable layer so as to block a visible light from passing there-through
Implementation Method 3
The light-permeable layer has an outer surface and an inner surface. The inner surface has an assembling region being ring-shaped
Data Source
AI summary
A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the substrate and surrounding the sensor chip, a light-permeable layer disposed on the light-curing layer, and a shielding layer that is ring-shaped and that is disposed on the light-permeable layer. And inner surface of the light-permeable layer, the light-curing layer, and the substrate jointly define an enclosed space that accommodates the sensor chip. A first projection area defined by orthogonally projecting the shielding layer onto the inner surface does not overlap the assembling region. A second projection area defined by orthogonally projecting the sensing region onto the inner surface along the predetermined direction does not overlap the first projection area and is located inside of the first projection area.