Sensor Package Base Core With Protruding Stoppers To Prevent Compound Overflow

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Solution Overview

Problem

Conventional sensor packaging is hindered by compound overflow and unstable connections between the compound and the dam core, leading to increased costs, product returns, and reliability issues.

Innovation Solution

A package base core with protruding stoppers is designed to prevent compound overflow and enhance the connection between the compound and the substrate, featuring a substrate with stoppers having exposed and shielding portions, where the compound covers the shielding portions and has a slanting angle for improved demolding and retention.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional packaging process is used, then production cost is reduced, but compound overflow occurs and connection stability deteriorates

Engineering Contradiction:

Improveconnection stabilityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The stopper is divided into multiple functional segments: a body portion embedded in the substrate, an exposed portion extending upward, and a shielding portion positioned between the compound and exposed portion. This segmentation allows each part to perform its specific function - the body provides structural support, the exposed portion allows compound access, and the shielding portion prevents overflow - thereby improving connection stability without requiring complex external packaging structures.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The stopper structure extends in the vertical dimension from the substrate surface, creating multiple levels (embedded body, exposed portion, shielding portion). This vertical dimensionality change allows the compound to be contained and directed in the Z-axis direction, preventing overflow while maintaining a relatively simple planar footprint on the substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If stoppers with shielding portions are added, then compound overflow is prevented, but manufacturing complexity increases

Engineering Contradiction:

Improvecompound placement precisionVSAvoidstopper fabrication ease

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The stopper integrates multiple functions into a single component: structural support (body portion), overflow prevention (shielding portion), and compound guidance (exposed portion). By merging these functions into one integrated stopper structure rather than using separate components, the manufacturing process is simplified while achieving precise compound placement and overflow control.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The stopper structure is designed to be self-forming during the compound dispensing process. The shielding portion automatically contains the compound within defined boundaries, and the exposed portion naturally guides compound flow to the intended location. This self-service mechanism eliminates the need for complex external molds or alignment fixtures, improving ease of manufacture while maintaining high precision.

Inventive Principle:

Principle #25Self-service

3Productivity

If protruding stoppers are used, then compound overflow is avoided, but production cost increases

Engineering Contradiction:

Improveproduction yieldVSAvoidpackage base core complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The stopper structure implements local quality by concentrating structural complexity only where needed - the shielding portion is positioned specifically at the compound-dispensing location to prevent overflow, while other areas of the substrate maintain simple, flat geometry. This localized approach improves production yield by preventing defects at critical locations without increasing overall package complexity or cost.

Inventive Principle:

Principle #3Local quality

4Reliability

If covering layers are added to protrusions, then connection reliability is improved, but manufacturing steps increase

Engineering Contradiction:

Improvecompound-stopper connection reliabilityVSAvoidmanufacturing process simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The covering layer is pre-formed on the exposed portion of the stopper before compound dispensing. This preliminary action ensures that the compound makes immediate contact with the adherent covering layer upon dispensing, establishing a reliable bond from the start. The covering layer is integrated into the stopper fabrication process, so no additional manufacturing steps are required beyond the standard multi-layer deposition already used in semiconductor packaging.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS10600829B2Package base core and sensor package structure

Publication Date: 2020.03.24 TONG HSING ELECTRONICS IND LTD

AI summary

The present disclosure provides a package base core and a sensor package structure. The package base core includes a substrate and at least one stopper, or the package base core includes a substrate, at least one stopper, and a compound. The sensor package structure includes a substrate, a first stopper, a second stopper, a sensing member, a first compound, a second compound, and a translucent member. The stopper (or the first and second stoppers) of the present disclosure is provided to form with a protruding portion on the substrate, so that an overflowing of the compound can be avoided, thereby increasing the reliability of the package base core.