Sensor Package Through Hole Positioning for Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices face challenges in miniaturization and mechanical strength due to the placement of through holes for pressure reduction or inert gas filling, which increases package size and decreases mechanical integrity.
Innovation Solution
The solution involves a package design with a through hole positioned to overlap with the mounting component in a plan view, utilizing a spacer to communicate the hole with the housing space and incorporating projection portions and wall structures to prevent adhesive flow into the hole, thereby allowing for miniaturization and maintaining mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the through hole is disposed shifted with respect to the IC chip installation area, then the opening can be accessed for sealing, but the package size increases and mechanical strength decreases
Solution Approach 1:
The patent positions the through hole opening on the rear surface of the IC chip rather than on the front surface, utilizing the third dimension (depth/vertical arrangement) to resolve the conflict between accessibility and compactness. This allows the through hole to be accessed without increasing the planar footprint of the package.
2Ease of manufacture
If the through hole is disposed shifted with respect to the IC chip installation area, then the opening can be accessed for sealing, but the mechanical strength of the package decreases
Solution Approach 1:
By moving the through hole opening to the rear surface of the IC chip in the vertical dimension, the patent maintains the structural integrity of the package base while still providing accessible access to the through hole for sealing operations.
3Volume of moving object
If the through hole is positioned to overlap with the mounting component, then the package size is reduced, but adhesive may flow into the through hole
Solution Approach 1:
The patent introduces a resin layer as an intermediary substance between the package base and the IC chip. This resin layer fills and seals the through hole, preventing adhesive from flowing into it while still allowing the components to be positioned in overlapping configuration for miniaturization.
4Volume of moving object
If the through hole is positioned to overlap with the mounting component, then the package size is reduced, but the mounting component cannot be properly bonded to the base
Solution Approach 1:
The resin layer serves as a mediator that simultaneously enables package miniaturization through overlapping positioning and ensures proper bonding by providing a bonding surface and preventing adhesive contamination of the through hole.
Data Source
AI summary
A sensor device includes an IC chip, a package which includes a base in which the IC chip is provided and houses the IC chip, the base having a through hole provided in a position that overlaps with the IC chip in the plan view, and a spacer which is provided between the IC chip and the base, and has an aperture communicating the through hole with the space on the opposite side to the base with respect to the IC chip in the package between the IC chip and the space.