Sensor Packaging Structure with Ceramic Protection Board
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Solution Overview
Problem
Existing sensor packaging structures with plastic protection layers fail to provide effective structural, chemical, and electrostatic protection for sensor chips, and suffer from low manufacturing accuracy due to tolerance accumulation during assembly.
Innovation Solution
A sensor packaging structure comprising a protection board, a circuit structure with a chip and substrate connected back-to-back, and a filling structure on the outer periphery of the circuit, where the protection board serves as a protective layer and is connected to the circuit structure in advance to prevent tolerance accumulation and ensure high manufacturing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plastic filling portion is used as the protection layer in the prior art packaging structure, then the manufacturing process is simple, but the protection effectiveness against structural, chemical, and electrostatic damage is insufficient
Solution Approach 1:
The patent employs a ceramic filling portion instead of conventional plastic material. Ceramic materials provide superior structural strength, chemical inertness, and electrostatic protection properties compared to plastic, thereby resolving the contradiction between protection effectiveness and material limitations while maintaining packaging structure integrity.
Solution Approach 2:
The invention changes the material parameters of the filling portion from plastic to ceramic, fundamentally altering the protective characteristics. This material parameter change enables the filling portion to simultaneously provide mechanical protection, chemical resistance, and electrostatic shielding, effectively resolving the protection insufficiency issue.
2Manufacturing precision
If the filling portion is manufactured last in the assembly sequence, then the assembly process is straightforward, but tolerance accumulation results in low manufacturing accuracy of the protection layer
Solution Approach 1:
The patent integrates the protection layer formation into the injection molding process itself, rather than adding it as a separate final step. The ceramic filling portion is injected and formed simultaneously with the packaging structure, eliminating subsequent assembly steps and preventing tolerance accumulation, thus achieving high manufacturing accuracy while simplifying the overall process.
Solution Approach 2:
The invention merges the protection layer formation with the main packaging structure manufacturing in a single injection molding operation. This consolidation eliminates the need for separate assembly steps and prevents tolerance accumulation from multiple manufacturing stages, thereby achieving high manufacturing accuracy without increasing process complexity.
Data Source
AI summary
Disclosed in the present invention are a sensor packaging structure and a manufacturing method thereof. The sensor packaging structure includes a protection board, a circuit structure and a filling structure. A front surface of the circuit structure is connected to a first surface of the protection board. A second surface of the protection board is used as a sensing function surface. The filling structure is located on the outer periphery of the circuit structure and connected to the first surface of the protection board. The sensor packaging structure of the present invention uses the protection board as a protection layer of the functional circuit, which can effectively protect the functional circuit of the sensor. Meanwhile, the protection board is first connected to the circuit structure in the manufacturing method to avoid tolerance accumulation, increasing the manufacturing accuracy of the protection layer.