Semiconductor Sensor Packaging With Open Detection Well Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor sensor packaging fully encapsulates the die, restricting access to the active area and preventing interaction with fluid samples, which is essential for diagnostic applications, and hinders the development of compact, user-friendly diagnostic tools.
Innovation Solution
A packaged semiconductor sensor design with an open detection area and a support member featuring a detection window, sealed by a z-axis conductive adhesive, allowing fluid sample contact while maintaining electrical connections and protecting the semiconductor die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If full encapsulation is used to protect the semiconductor die, then reliability is improved, but the detection area cannot access fluid samples
Solution Approach 1:
The packaging structure is segmented into distinct functional zones: a sealed encapsulation region protecting the bond pads and electrical connections, and an open detection region exposing the detection area to fluid samples. This segmentation allows simultaneous protection of sensitive components and accessibility of the detection area.
Solution Approach 2:
Different regions of the semiconductor die receive different treatments: the bond pad areas are fully encapsulated for protection, while the detection area remains exposed for fluid interaction. This local differentiation of quality enables both reliability and operational functionality.
2Reliability
If wire bonding is used for electrical connections, then electrical connectivity is achieved, but device complexity increases
Solution Approach 1:
The support member integrates multiple functions into a single component: it provides mechanical support for the die, forms the sealed encapsulation structure, creates the detection window opening, and incorporates conductive traces for electrical connections. This merging reduces the number of separate components and simplifies the overall packaging structure.
Solution Approach 2:
The support member serves multiple purposes simultaneously: structural support, sealing encapsulation, defining the detection area through the window, and providing electrical pathways via integrated conductive traces. This multi-functionality reduces device complexity while maintaining all necessary functions.
3Reliability
If traditional packaging is used, then protection is provided, but compact and user-friendly diagnostic tools cannot be developed
Solution Approach 1:
The detection window creates a vertical opening through the support member, allowing fluid samples to access the detection area from above while the die remains protected below. This dimensional approach enables both protection and sample interaction in a compact configuration suitable for portable diagnostic devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective sample analysis by ensuring the detection area remains unobstructed for interaction while safeguarding the semiconductor device, facilitating compact and user-friendly diagnostic tools.
Implementation Method 1
A z-axis conductive adhesive bonds and electrically connects a respective one of the bond pads to a corresponding one of the conductive traces
Implementation Method 2
The sealing member can comprise at least one of an epoxy, glue, pressure sensitive adhesive and gasket
Data Source
AI summary
The present invention relates to a novel packaging structure for a bare die semiconductor sensor, specifically designed for diagnostic applications where direct fluid sample contact with the sensor's detection area is required. The packaged semiconductor sensor comprises a semiconductor die with a top surface featuring bond pads and a detection area, and a bottom surface. A support member with a top side, a bottom side, and a detection window forms a sample well for receiving a fluid sample when aligned with the detection area. Z-axis conductive adhesive electrically connects bond pads to conductive traces on the support member. A sealing member seals the sample well, preserving sensor functionality while allowing the detection area exposure to the sample. This innovative packaging solution protects the sensor from environmental factors and maintains electrical integrity, enabling accurate and efficient biomarker detection in diagnostic procedures.