Sensor Unit Packaging with Isolation Groove to Reduce Crosstalk
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Solution Overview
Problem
The manufacturing process of traditional proximity sensors is complex due to the precise assembly of metal frames and the use of glue, which can lead to signal crosstalk and reduced manufacturing yields, especially in small-sized devices.
Innovation Solution
A method involving a mold to form a packaging structure with a separation member, isolating the signal emitting and detecting devices, reducing manufacturing costs and improving signal shielding through precise isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal frame with locking structures is assembled with packaging materials to shield signals, then signal isolation is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent merges the packaging structure and isolation structure into a single integrated component. The packaging structure includes integrated walls that extend to form isolation barriers, eliminating the need for separate metal frames and locking structures. This integration maintains signal isolation while significantly simplifying the manufacturing process.
Solution Approach 2:
The patent extracts the complex metal frame assembly process entirely from the design. Instead of using separate metal frames with locking structures, the isolation function is achieved through the packaging structure itself, which is formed in a single molding process without requiring additional assembly steps.
2Ease of manufacture
If glue is used to fix the metal frame on the packaging structure, then assembly is simplified, but manufacturing precision and reliability deteriorate due to uncontrolled glue application
Solution Approach 1:
The patent combines the packaging structure and isolation structure into one integrated component molded in a single process. This eliminates the need for glue application entirely, as there are no separate parts to attach. The integration ensures precise positioning without relying on adhesive control.
3Reliability
If precise assembling of metal frame and packaging structure is performed, then signal isolation is improved, but productivity decreases due to complex assembly processes
Solution Approach 1:
The patent merges multiple components into a single integrated packaging structure that is molded in one process. This eliminates complex assembly operations and enables high-volume production through efficient molding processes, significantly improving productivity while maintaining signal isolation performance.
Solution Approach 2:
The isolation structures are pre-formed as integral parts of the packaging structure during the molding process itself. This preliminary formation of isolation barriers eliminates the need for subsequent assembly operations, streamlining production and improving manufacturing efficiency.
4Ease of manufacture
If excess glue is applied to fix the metal frame, then assembly is simplified, but signal crosstalk increases due to glue overflow
Solution Approach 1:
The patent integrates the packaging and isolation structures into a single molded component, eliminating the need for glue application. This removes the source of the problem entirely - without separate parts to attach, there is no glue to overflow, and thus no risk of signal crosstalk from adhesive contamination.
Data Source
AI summary
A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.