Environmental Sensor Packaging with Elastomer Flanges for Stress Isolation
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Solution Overview
Problem
Existing environmental sensor packages struggle to expose sensing elements to the external environment while protecting them from damage or degradation, particularly in applications requiring gas or pressure sensing, and often compromise manufacturing efficiency during assembly.
Innovation Solution
A method involving encapsulating sensor devices on a carrier substrate with elastomer material and bonding a cover separated by a gap, using recessed channels to form flanged areas for secure sealing and isolation, allowing for high-volume manufacturing without damaging the sensors during dicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensor devices are encapsulated in elastomer material to protect them from damage, then sensor protection is improved, but manufacturing complexity increases due to the bonding and sealing processes required
Solution Approach 1:
The package is divided into distinct functional regions: a first region with the sensor device encapsulated in elastomer, and a second region with recessed channels that receive the cover. This segmentation allows the bonding interface to be located only in the second region, simplifying the overall manufacturing process while maintaining sensor protection.
Solution Approach 2:
The elastomer material serves as an intermediary that provides both protection for the sensor device and a bonding surface for the cover in the second region. The recessed channels in the elastomer create flanged areas that facilitate reliable bonding without requiring complex assembly processes.
2Ease of manufacture
If a cover is bonded directly to the elastomer material, then sealing is simplified, but stress concentrates on the sensor device causing potential damage
Solution Approach 1:
The package structure segments the cover bonding location from the sensor device location using recessed channels. The cover bonds to the elastomer in the second region (away from the sensor), while the first region maintains a gap between the cover and elastomer, preventing stress transmission to the sensor.
Solution Approach 2:
Different regions of the elastomer have different properties: the first region above the sensor maintains a gap with the cover to provide stress relief, while the second region contains recessed channels that enable bonding. This local differentiation allows both simplified sealing and sensor protection.
3Volume of moving object
If the cover is positioned close to the sensor device, then package size is reduced, but stress from bonding damages the sensor during manufacturing
Solution Approach 1:
The package uses vertical dimensionality through recessed channels to achieve stress isolation. The cover bonds to the elastomer at a lower vertical position (in the second region), while the sensor resides in the first region above it. This vertical separation protects the sensor during bonding while maintaining a compact overall package footprint.
4Adaptability or versatility
If elastomer material is used to expose sensing elements to the environment, then sensor functionality is improved, but manufacturing efficiency decreases due to complex assembly steps
Solution Approach 1:
The elastomer material simultaneously performs multiple functions: it encapsulates and protects the sensor device, provides environmental exposure through its permeable properties, and creates bonding surfaces in the recessed channels for the cover. This merging of functions reduces the number of separate manufacturing steps required.
Solution Approach 2:
The elastomer material self-forms the bonding interface through the recessed channels that protrude into the elastomer body. These channels automatically create flanged areas that guide and support the cover bonding process, reducing the need for additional manufacturing steps or specialized tooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective protection and exposure of sensor elements while enabling efficient assembly and sealing, facilitating high-volume manufacturing and ensuring sensor integrity.
Implementation Method 1
encapsulating a first sensor device on a top surface of carrier substrate within a volume of elastomer material
Implementation Method 2
bonding a cover to the carrier substrate that overlies the volume of elastomer material
Data Source
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AI summary
One or more sensor devices are encapsulated on a top surface of a carrier substrate within an elastomer material. The carrier substrate includes one or more recessed channels adjacent to each sensor device which are filled by a portion of the elastomer material to create flanged areas that are level with the top surface of the carrier substrate. A cover which can include a liquid or gas input port or other related structures can be placed over each sensor device and bonded to the carrier substrate at the flanged areas, creating a seal between the cover and the carrier substrate that surrounds each sensor device.