Sensor Pad Layout for Short-Circuit Detection in Touch and Pen Layers
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Solution Overview
Problem
Existing electronic devices face challenges in accurately detecting short circuit defects, particularly in sensor layers that require both touch and pen input capabilities, leading to potential malfunctions and reduced reliability.
Innovation Solution
The electronic device incorporates a specific electrode and wiring line arrangement, including first and second type pads and wiring lines, with alternating and overlapping configurations, to enhance detection power for short circuit defects, allowing for improved sensing of touch and pen inputs without increasing thickness or weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional electrode and pad arrangements are used, then the device structure remains simple, but the detection power for short circuit defects is insufficient
Solution Approach 1:
The pad structure is segmented into two distinct types: first type pads electrically connected to first and second electrodes, and second type pads electrically connected to third electrodes. This segmentation allows for specialized detection pathways that improve short circuit defect detection while maintaining a manageable structural complexity through systematic organization.
Solution Approach 2:
Different regions of the sensor layer are assigned different pad types with specific electrical connection characteristics. First type pads provide one detection pathway while second type pads provide another, allowing local optimization of detection capabilities in different areas of the device without requiring complete redesign of the entire structure.
2Measurement precision
If additional detection mechanisms are added, then detection power improves, but the device thickness and weight increase
Solution Approach 1:
The sensor layer structure serves multiple functions simultaneously: it detects touch inputs, detects pen inputs, and detects short circuit defects through the specially arranged first and second type pads. This multi-functionality is achieved within the existing sensor layer framework without adding separate detection mechanisms that would increase weight.
Solution Approach 2:
The detection capability is enhanced by utilizing the electrical connection dimension rather than adding physical thickness. The alternating arrangement of first and second type pads creates multiple electrical detection pathways within the same planar space, improving detection power without increasing device thickness or weight.
3Measurement precision
If additional detection mechanisms are added, then detection power improves, but the device structure becomes more complex
Solution Approach 1:
The wiring lines for first type pads and second type pads are merged into the same layer structure, with first type wiring lines and second type wiring lines arranged alternately. This merging approach consolidates multiple detection pathways into a unified structural framework, improving detection capability while avoiding the complexity of separate multi-layer wiring systems.
Solution Approach 2:
Multiple detection pathways are achieved by utilizing the planar arrangement dimension rather than stacking multiple layers. The alternating arrangement of first type and second type wiring lines in the same layer creates independent detection pathways without increasing vertical complexity, maintaining structural simplicity while enhancing detection power.
4Measurement precision
If alternating arrangement of first and second type pads is implemented, then short circuit detection power is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The pad structure is segmented into two distinct types with clear electrical connection definitions: first type pads connected to first and second electrodes, and second type pads connected to third electrodes. This segmentation provides clear manufacturing guidelines for each pad type, reducing positioning ambiguity and helping maintain manufacturing precision while achieving enhanced detection capability.
Solution Approach 2:
The electrical connection relationships are predetermined and assigned to each pad type before the actual detection process. First type pads are pre-configured for specific electrode connections and second type pads for other connections, allowing manufacturing processes to follow established patterns rather than requiring high-precision adaptive positioning during assembly.
Data Source
AI summary
An electronic device includes a plurality of first electrodes, a plurality of second electrodes, a plurality of third electrodes, a plurality of first type pads electrically connected to the plurality of first electrodes and the plurality of second electrodes, and a plurality of second type pads electrically connected to the plurality of third electrodes, wherein at least one of the plurality of first type pads is located between two adjacent second type pads from among the plurality of second type pads.