Sensor Panel Deformation Suppression via Elastic Modulus Differential
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Solution Overview
Problem
The existing radiation imaging apparatus may damage the sensor panel when inserting and removing rigid members for pressure-bonding wiring members, leading to deformation issues during the process.
Innovation Solution
A method is introduced where a sensor panel with a higher elastic modulus supporting portion is used to inhibit the removal of a second supporting portion, which supports electrical contacts, allowing for pressure-bonding of wiring members without deforming the sensor panel, with the elastic modulus of the supporting portion being higher than the adhesive layer during pressure-bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid members are inserted into gaps between the supporting substrate and sensor panel during pressure-bonding, then deformation of the sensor panel is suppressed, but the sensor panel may be damaged when members are inserted and removed
Solution Approach 1:
The patent changes the physical parameter of the supporting portion by using a second supporting portion with higher elastic modulus than the adhesive layer. This parameter change allows the supporting portion to maintain rigidity during pressure-bonding without requiring insertion of rigid members, thereby suppressing sensor panel deformation while avoiding damage from member insertion and removal operations.
Solution Approach 2:
The patent extracts the function of deformation suppression from the insertable rigid members and integrates it into the second supporting portion through material selection (higher elastic modulus). This eliminates the need for separate rigid members that cause damage during insertion and removal, while maintaining the essential function of preventing sensor panel deformation during pressure-bonding.
2Stability of the object's composition
If the elastic modulus of the second supporting portion is higher than the adhesive layer, then the sensor panel is suppressed from deforming during pressure-bonding, but the device complexity increases
Solution Approach 1:
The patent merges the function of the second supporting portion into the existing supporting substrate structure. By integrating the deformation suppression function directly into the supporting portion rather than adding separate components, the patent achieves sensor panel stability during pressure-bonding without significantly increasing device complexity.
Solution Approach 2:
The patent achieves deformation suppression through parameter change (elastic modulus selection) of the second supporting portion material rather than through complex structural design. This allows the function to be achieved through material property optimization, keeping the overall device structure relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses deformation and damage to the sensor panel during the pressure-bonding process, ensuring high-quality radiation images by maintaining the integrity of the sensor panel and improving adhesiveness between wiring members and electrical contacts.
Implementation Method 1
adhering a first supporting portion to the sensor panel with an adhesive layer
Implementation Method 2
an elastic modulus of the second supporting portion in the pressure-bonding is higher than an elastic modulus of the adhesive layer in the pressure-bonding
Implementation Method 3
pressure-bonding wiring members to the electrical contacts
Data Source
AI summary
A radiation detection apparatus employs a sensor panel having first and second opposing surfaces with a pixel array and electrical contacts arranged on the first surface side. A first supporting portion is secured to the panel with an adhesive layer, and supports the pixel array from the second surface side of the panel. A second supporting portion is fixed to the panel so as to inhibit the second supporting portion from being removed from the panel. The second supporting portion supports the electrical contacts from the second surface side of the panel. The elastic modulus of the second supporting portion is higher than that of the adhesive layer, and a number of wiring members are pressure-bonded to the electrical contacts.