Sensor Panel Heat Isolation Using an IC Heat Absorbing Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Heat generated in the IC chip is transmitted to the sensor panel via the support member, causing noise and deteriorating image quality and reliability in radiation imaging devices.
Innovation Solution
A radiation imaging device with a heat absorbing member that includes a heat absorbing portion overlapping the flexible printed circuit and a heat radiating portion extending outward, effectively absorbing and dissipating heat from the IC chip to suppress noise and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fixing material is used to fix the IC chip to the support member, then heat can be transmitted from the IC chip to the support member, but heat is also transmitted to the sensor panel via the support member, causing noise and deteriorating image quality
Solution Approach 1:
The patent introduces a heat absorbing member as an intermediary component between the IC chip and the support member. This mediator absorbs heat from the IC chip through its heat absorbing portion while preventing the heat from being transmitted to the support member and subsequently to the sensor panel, thus eliminating the harmful thermal noise while maintaining effective heat dissipation from the IC chip.
Solution Approach 2:
The heat absorbing member is segmented into two distinct functional portions: a heat absorbing portion that contacts the IC chip and absorbs heat, and a heat radiating portion that extends outward to dissipate heat to the surrounding environment. This segmentation allows the device to perform both heat absorption and heat radiation functions simultaneously, preventing heat transmission to the sensor panel while maintaining thermal management effectiveness.
2Temperature
If the heat radiating portion is made thicker, then heat absorption capacity is improved, but the device size increases
Solution Approach 1:
The heat absorbing portion is designed with a thickness that is greater than or equal to that of the heat radiating portion, concentrating the thermal management resources where they are most needed - at the interface with the IC chip. This local quality optimization ensures maximum heat absorption capacity at the heat source while minimizing the overall volume of the heat absorbing member, thus resolving the contradiction between heat absorption capacity and device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration suppresses the transfer of heat from the IC chip to the sensor panel, enhancing image quality and reliability by reducing noise and facilitating easy replacement of components.
Implementation Method 1
a contact surface that contacts a surface of the IC chip opposite to a mounting surface of the IC chip on the flexible printed circuit
Implementation Method 2
a heat radiating portion connected to the heat absorbing portion and extending outward beyond an outer edge of the flexible printed circuit
Implementation Method 3
the surface area of the portion of the heat radiating portion that is in contact with air can be appropriately secured
Data Source
Figure 1(A)~1(C)
Figure 2
Figure 3
AI summary
A radiation imaging device according to an embodiment includes a sensor panel, a support member that supports the sensor panel, a control board disposed at a position facing a back surface of the support member, a flexible printed circuit disposed to connect the sensor panel and the control board, an IC chip mounted on the flexible printed circuit, and a heat absorbing member provided between the support member and the IC chip and configured to absorb heat from the IC chip. The heat absorbing member includes a heat absorbing portion disposed in a region overlapping the flexible printed circuit and having a contact surface that contacts a surface of the IC chip, and a heat radiating portion connected to the heat absorbing portion and extending outward beyond an outer edge of the flexible printed circuit. A thickness of the heat radiating portion is greater than a thickness of the heat absorbing portion.