Temperature Sensor Patterning on Electro-Optic Transducer Die

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Solution Overview

Problem

The temperature control of electro-optic transducer junctions in optical transmission systems is hindered by thermal resistance between the temperature sensor and the transducer, leading to inaccuracies in temperature measurement and control, which affects the frequency of optical emissions and increases the risk of inter-signal interference.

Innovation Solution

Patterning a temperature sensor directly on the surface of the electro-optic transducer die reduces thermal resistance, allowing for more accurate temperature measurement and tight control of the transducer junction temperature, thereby controlling the frequency of optical emissions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a temperature sensor is placed in proximity to the electro-optic transducer junction for temperature control, then temperature control capability is improved, but thermal resistance between the sensor and junction increases leading to measurement inaccuracy

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoiddistance between temperature sensor and transducer junction
Core Design Contradiction:
Measurement precisionVSLength of stationary object

Solution Approach 1:

The temperature sensor is integrated directly onto the transducer die surface, merging the sensing function with the transducer structure. This eliminates the need for separate mounting and reduces the distance between sensor and junction to minimal levels, thereby minimizing thermal resistance and improving measurement accuracy

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The temperature sensor is patterned on the surface of the transducer die in a two-dimensional plane, allowing the sensor to be positioned in close proximity to the junction without adding vertical height or interfering with the junction's three-dimensional structure. This surface-level integration enables optimal thermal coupling while maintaining spatial separation of functions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the temperature sensor is placed closer to the electro-optic transducer junction, then thermal resistance is reduced improving temperature tracking, but the complexity of integrating the sensor increases

Engineering Contradiction:
Improvetemperature control reliabilityVSAvoidintegration complexity of temperature sensor
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The transducer die itself serves as the mounting substrate for the temperature sensor, eliminating the need for separate mounting structures, thermal interfaces, and alignment mechanisms. The die provides both the functional transducer element and the thermal coupling pathway, simplifying the overall integration while improving reliability

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The transducer die is designed to serve multiple functions: it acts as the electro-optic transducer element, provides structural support, and serves as the thermal coupling medium for the temperature sensor. This multi-functionality reduces the number of separate components and interfaces needed, thereby reducing integration complexity while improving thermal coupling reliability

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables precise temperature control of the electro-optic transducer junction, reducing inter-signal interference and potentially allowing for a narrower frequency span in DWDM systems, thus increasing optical data rates.

Implementation Method 1

a temperature sensor is provided in proximity to the electro-optic transducer junction... there will be some finite amount of thermal resistance between the temperature sensor and the electro-optic transducer junction

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The electro-optic transducer emits light when current is passed through it, the intensity of the emitted light being a function of the current magnitude

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 3

The temperature of the electro-optic transducer junction may vary significantly as the electro-optic transducer itself generates heat

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS7706421B2Temperature sensing device patterned on an electro-optic transducer die
Publication Date: 2010.04.27 II VI DELAWARE INC
  • US7706421B2 patent drawing
  • US7706421B2 patent drawing
  • US7706421B2 patent drawing

AI summary

An optical transmit assembly having a temperature sensor patterned on an electro-optic transducer die. Due to the close proximity of the electro-optic transducer junction and the temperature sensor, the temperature sensor more accurately measures the temperature of the electro-optic transducer junction. This permits for more refined control of the frequency characteristics of optical light emitted by the electro-optic transducer junction since the emitted optical frequencies of most electro-optic transducers are heavily temperature dependent.